Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Transport Package: Wooden Case
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Year of Establishment
2014-12-30
Address
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, ...
Registered Capital
1,000,000 RMB
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester pictures & photos
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
  • Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester

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Overview

Basic Info.

Model NO.
MD-BT101
Specification
L: 500mm W: : 550mm H: : 440mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Packaging & Delivery

Package Size
100.00cm * 80.00cm * 90.00cm
Package Gross Weight
90.000kg

Product Description

Product Description
MD-BT101 Multifunctional Bond Tester
The push-pull force testing machine can perform strength testing of wire bonding after microelectronic wire bonding, adhesion testing between solder joints and substrate surfaces, and repetitive thrust fatigue testing of solder balls (internal wire tension testing, micro solder joint thrust testing, gold ball thrust testing, chip shear force testing, SMT soldering component thrust testing, BGA matrix overall thrust testing). The multifunctional push-pull force testing machine is widely used in LED packaging testing, IC semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive field, aerospace field, research institution testing, and various universities' testing and research applications.
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Specification
Test Module
Shear Test-Ball/Die/Zone
Pull Test-Wire
Transducer
Auto Range
Transducer
Auto Range
BS250G
250g
100g
50g
25g
WP25G
25g
BS1KG
1000g
500g
200g
100g
WP50G
50g
BS5KG
5kg
2.5kg
1kg
500g
WP100G
100g
BS20KG
20kg
10kg
4kg
2kg
WP1000G
1000g
DS100KG
100kg
50kg
20kg
10kg
WP5KG
5kg
DS200KG
200kg
100kg
40kg
20kg
WP10KG
10kg
ZoneDS-100KG
100kg
50kg
20kg
10kg
WP20KG
20kg







Push Test-Down/Pull
Pull Test-Tweezer/ColdBump
Transducer
Auto Range
Transducer
Auto Range
DP100G
100g
50g
25g
10g
TP100G
100g
DP5KG
5kg
2.5kg
1.25kg
500g
TP5KG
5kg
PP5KG
5kg
2.5kg
1.25kg
500g
CBP100G
100g
PP50KG
50kg
25kg
10kg
5kg
CBP5KG
5kg
Accuracy
MFM1200 Series ±0.25%FS
MFM1500 Series ±0.1%FS
Specifications
Machine
Machine footprint
Depth 600mm,Width 700mm(Including left and right joystick controllers),Height 800mm
Weight
65kg
Power Supply
100/110V&220/240V [email protected] 50/60Hz
Pneumatic
Supply(for machine)4.5Bar Minimum
Vacuum
Supply(for workholder)550mm Hg Minimum
Pneumatic
6mm OD/4mm IDplastic pipe
Control PC
Specialized PC with standard configuration
Operating System
Windows7/Windows 10


Max Force for Machine Body
500kg
Axis
X,Y axis travel
100*100mm(standard)
X,Y axis accuracy
±10 um Ful Travel
X,Yaxis repeatability
±5um FullTravel
X,Yaxis resolution
<0.125um
X,Y axis maximum speed
2mm/s
Yaxis maximum force
100kg(standard)200kg(optional)
Xaxis maximum force
20kg
Zaxis trave
60mm
Z axis accuracy over Full Trave
±10 um
Z axis accuracy over 2mm
±1 um
Zaxis resolution
±0.125um
Z axis maximum speed
7mm/s
Z axis maximum force
20kg
XY Tables
100*100mm(standard)
Maximum Force:100kg(standard)200kg(option)
200*200mm
Maximum Force:100kg(standard)200kg(option)
320*320mm
Maximum Foroe:50kg(standard)
1. All sensors adopt high-speed dynamic sensing and high-speed data acquisition systems to ensure the accuracy of test data.
2. Adopting the company's unique high-resolution (24BitPlus ultra high resolution) data acquisition system.
3. Adopting the company's unique safety limit and speed limit technology, making the operation easy and convenient.
4. Adopting the company's unique intelligent lighting control and adjustment system to reduce the damage of light sources to vision.
5. Equipped with a high-definition observation microscope as standard, reducing visual fatigue for personnel.
6. Dual rocker four way operation and user-friendly software configuration make operation simple and convenient.
7. Combining the unique design of ergonomics, making use more comfortable.
8. Comprehensive protective measures for equipment to avoid damage caused by personnel's mis operation 
9. Strong R&D capabilities, providing customized products according to customer needs.
10. Attentive after-sales service ensures that users have no worries or concerns.
Factory and Equipment Real Shot
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Packing & Delivery
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
Company Profile

Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. 
We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
Semiconductor LED IC to Packaging Test/ Bond Tester / Die Shear Testing /Wire Pull Push Tester
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
 
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
 
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
 
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
 
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
 
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 
7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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