Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach

• After-sales Service: 1 Year
• Demoulding: Automatic
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Driven Type: Electric
• Specification: 500KG
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description
Automatic loading and unloading crystal fixing machine
Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products
Modular design, new optimized layout, focus on quality, with the best stable performance
You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers
Brand-new tying head design, fast die bond cycle up to 180ms

Patented head binding, accurate positioning and more stable operation;
5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs
Specification

360-8 inch wafer bonding machine technical specifications
Solid crystal workbench (linear module)		Optics System
Workbench stroke	450x220mm	Camera
Resolution	1μm	Optics Magnifier	0.7 times ~ 4.5 times
Epistar Workbench (Linear Module)		Cycle Time	200MS/EA
XY stroke	8"*8"	Die bond cycle	Less than 250 milliseconds
Resolution	1μm	Production capacity	Greater than 12k
Accuracy of wafer placement		Loading and unloading module	Manual loading and unloading
Stick position x-y	±2mil
Rotation accuracy	±3°
Dispensing module		Equipment Require
Use swing arm dispensing + heating system		Voltage	AC220V/50HZ
The dispensing needle group can be interchanged with single needle or multiple needles		Air Source	At least 6BAR
		Vacuum Source	700mmHG
		Power Consumpion	3000w
PR System		Dimensions And Weight
Method	256 grey levels	Weight	450kg
Detection	Ink/chipping/cracked die	Size(DxWxH)	1200*900*1500mm
Monitor	17" LCD
Monitor Resolution	1024*768	Missing Die	Vacuum Sensor

 

380-12 inch wafer bonding machine technical specifications
Solid crystal workbench (linear module)		Optics System
Workbench stroke	100x300mm	Camera
Resolution	1μm	Optics Magnifier	0.7 times ~ 4.5 times
Epistar Workbench (Linear Module)		Cycle Time	200MS/EA
XY stroke	12"*12"	The die bonding cycle is less than 250 milliseconds,  and the production capacity is greater than 12k;
Resolution	1μm
Accuracy of wafer placement		Loading and unloading module
Stick position x-y	±2mil	Automatic feeding method using vacuum suction cup Unloading using the material box container type receiving material Use pneumatic pressure plate type clamp, the width of the bracket can be adjusted in the range of 25~90mm
Rotation accuracy	±3°
Dispensing module		Equipment Require
Use swing arm dispensing + heating system The dispensing needle group can be interchanged with single needle or multiple needles		Voltage	AC220V/50HZ
		Air Source	At least 6BAR
		Vacuum Source	700mmHG(Vacuum pump)
		Power Consumpion	3000w
PR System		Dimensions And Weight
Method	256 grey levels	Weight	450kg
Detection	ink /chipping/cracked die	Size(DxWxH)	1200*1200*1500mm
Monitor	17" LCD
Monitor Resolution	1024*768

 

Bonding arm
Bonding arm	90 degree
Motor	AC servo moto
Wafer work stage
Stroke	6"*6"
resolution	0.2 mil (5μm)
Lead frame wore stage
Lead frame number	1PC
Stroke	10"*6"
Resolution	0.2 mil (5μm)
Die and wafer
Die dimension	5mil*5mil~100mil*100mil
Wafer dimension6	6
	:±3°
	:±1.5mil
	25g~35g
Ejector system
Sync with the part
Can adjust the height
Epoxy picking system
Epoxy picking arm	Rotary type
moto	AC servo moto

Product details
Sample