| After-sales Service: | 1 Year |
|---|---|
| Function: | Aoi |
| Demoulding: | Automatic |
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Post-Injection Molding Defect Inspection
| Project | Content |
| Application Scenarios | Both front and back sides of the strip and substrate are inspected |
| Applicable Product Specifications |
Width: 40X100mm, length: 100x300mm |
| Incoming Material Method | Cartridge clip/hand basket/stacking material |
| Identifiable Defect Types | Scratches, foreign objects, pollution, copper leakage, pressure damage, glue overflow, bubbles, damage, pits, discoloration, deformation, etc |
| Imaging System | Line scan camera, area scan camera, laser profiler |
| Precision | 4μm/pixel |
| Optional and Designated | Inkjet marking or laser marking |
| Project | Content |
| Product Type | LGA, QFN, BGA, QFP, SOP |
| 2D Inspection | Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls |
| 3D Inspection | BGA height, coplanarity, etc |
| Product Size | 3mmX3mm-120mmX120mm |
| Support Incoming Materials | Tray to Tray&Tray to Reel |
| 2D Visual System | 25MP |
| Pixel Resolution | 10μm/pixel |
| Project | Content |
| Product Type | 6", 8", 12" frame wafer |
| 2D Inspection ltems | Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive area, etc Cutting channel deviation and chipping |
| Cutting Path Inspection Items | 6", 8", 12" frame cassetee |
| Lens and Resolution | 2x(2.75um)/3.5x(1.57um)/ 5x(1.1um)/7.5x(0.73um)/10x(0.55um) |
| Precision | 0.55μm/pixel |
| Optional and Customized | INK module, IR module |
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
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