Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder

Product Details
Control: Manual
Cooling Way: Air Cooling
Conductive Way: One-Sided
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  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
  • Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
MDHX-M6000
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description

 

Equipment introduction
    MDHX-M6000 multifunctional bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.
    MDHX-M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure
control, high bonding accuracy; integrated design of the whole machine, compact structure, good user experience.
Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
Figure 1.1 Appearance of MDHX-M6000 Multifunctional Bonding Machine
Main parameters
Table 1.1 Main performance index of M6000 bonder
Wire diameter Gold wire: 15 μm - 100 μm
Platinum wire: 18 μm - 100 μm
Aluminium wire: 18 μm - 100 μm
Copper wire : 18 μm - 25 μm
Gold Ribbon: 50 μm ×12.5 μm - 300 μm × 25.4 μm
Chopper Type Φ1/16 1 6 mm ball welding chopper
Φ1/16, Φ3/32 19mm, 25mm wedge welding chopper
Maximum cavity depth 16mm
Welding pressure 1-250g, 1g subdivision step; program control, interface adjustable
Brake method Electric, no compressed air required
Pressure welding head vertical stroke 20mm
Pressure welding head horizontal stroke 15mm×15mm (operating handle ratio 8:1)
Wire clamp feeding stroke 800 μm
Feeding method 90° (deep cavity) or 45°
Liftable workbench Liftable height: 20 mm
Area: 270mm× 2 65mm
Ultrasound 0-10 W, maximum accuracy 0 .4 mW
wire feeder 1/2" or 2" spool
Interactive interface 7" TFT LCD touch screen, menu can be switched between Chinese and English
Fixture 2", 3", 4" slotted/unslotted hot or cold bench
Equipment application fields
MDHX-M6000 multifunctional wire bonder is widely used in microwave devices, hybrid circuits, RF devices/ modules, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.
Standard configuration
Table 1.2 Standard configuration of M6000 bonder
Name model
Device host MDHX-M6000 (Ball and wedge welding  bonder)
thermostat 220VAC 50/60Hz
Clamping table 3″ non-slotted countertop with clips, 200°C
microscope 15X magnification
spool 1/2″
wire clip 90°
Liftable workbench Stroke: 20mm
LED Ring Light 6W, stepless adjustment of brightness
Peripheral parameters
Table 1.3 Peripheral parameters of M6000 bonder
name model
Input voltage 220VAC±10%
power 500W _
frequency 50Hz - 60Hz
Dimensions 603mm (L)X596mm ( W) X319mm (H)
Total Weight 46 kg
Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
Figure 1. 2 MDHX-M6000 Multifunctional Bonding Machine Side View and Dimensions
Multifunctional Bonding Machine Wafer Ball Ball Bonder Golden Ball Semiconductor Ball Bonder
Figure 1. 3 MDHX-M6000 Multifunction Bonder Top View and Dimensions
FAQ
Q: How to buy your products ?
A: We have some products in stock , you can take away the products after you arrange the payment ;
If we don't have the products in stock you want, we will start production once getting the payment.
Q: What's the warranty for the products ?
A: The free warranty is one year from the date of commissioning qualified.
Q: Can we visit your factory ?
A: Of course, welcome to visit our factory if you come to China.
Q: How long is the validity of quotation ?
A: Generally, our price is valid within one month from the date of quotation. The price will be adjusted appropriately as the price fluctuation of raw material in the market.
Q: What's the production date after we confirm the order ?
A: This depends on the quantity. Normally, for the mass production, we need about one week to finish the production.

Please contact us for more detail information.
 

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