Manual Ultrasonic Thin Wire Wedge Bonding Machine

Product Details
After-sales Service: 1 Year
Transport Package: Plywood Packing by Fast Express
Specification: 50kg
Diamond Member Since 2017

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  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
  • Manual Ultrasonic Thin Wire Wedge Bonding Machine
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Basic Info.

Model NO.
mdb-2575
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8515809090
Production Capacity
500/Year

Product Description

Manual Ultrasonic Thin Wire Wedge Bonding MachineManual Ultrasonic Thin Wire Wedge Bonding MachineManual Ultrasonic Thin Wire Wedge Bonding MachineManual Ultrasonic Thin Wire Wedge Bonding MachineManual Ultrasonic Thin Wire Wedge Bonding MachineManual Ultrasonic Thin Wire Wedge Bonding Machine
Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm wedge bonding.

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
 

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