Semiconductor Machine IC to Package Full Automatic Deep Access Big Area Ball Bonding Machine Wire Bonder

• After-sales Service: 1 Year
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: MDSJSQB-3045
• Driven Type: Electric
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

MDSJSQB-3045 Full-automatic deep access big area ball bonding machine

 

 

Real-time deformation monitoring

Real-time ultrasonic energy monitoring

Arc control capability of fixed length and height

Piezoelectric ultrasonic motor tail wire control mechanism

Deep cavity bonding capacity of 16mm and 19mm cleat length

HD bonding head maintenance image assistant tool

Large area of coal connection area
 

Scope of application	Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc
Welding accuracy	±3um
Welding line area	305mm in X direction, 457mm in Y direction, 0~180 ° rotation range
Ultrasonic range	0~4W control accuracy, ladder flexible application capability
Arc control	Fully programmable
Cavity depth range	Maximum 12mm
Bonding force	0~220g
Cleave length	16mm,19mm
Type of welding wire	Gold thread (18um~75um)
Welding line speed	≥4wires/s
operating system	Windows
Net weight of equipment	1.2T
Installation requirements
input voltage	220V+-10%@50/60Hz
Rated power	2KW
Compressed air requirements	≥0.35MPa
area covered	Width 850mm * depth 1450mm *height 1650mm

 

 

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and we can provide you with a one-stop IC Package Line Equipment solution !!