• Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
  • Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
  • Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
  • Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
  • Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying

Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying

After-sales Service: 1 Year
Warranty: 1 Year
Movement Way: Combined
Atomization: Rotary Atomization
Flow: Cross Flow
Heating Mode: Dielectric
Diamond Member Since 2017

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Basic Info.

Model NO.
MDSD
Material Status
Solution
Drying Medium
Inactive Gas
Operation Pressure
Vacuum
Operational Method
Continuous
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

MDSD wafer dryer

Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer DryingMDSD wafer dryer
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer DryingSrd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer DryingSrd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
 Features
* Reasonable structure design and mature technology
*Simple operation, convenient maintenance, stable and reliable operation of the whole machine
* Low vibration, good reliability and large output
technical parameter
*Wafer size: applicable to 2-12-inch production line
*Fragment rate: 1/10000
application area
SPM acid cleaning, organic cleaning, development, degumming, ITO etching, BOE etching, uniform glue and other process wafer drying
Equipment function
The equipment is divided into 2 stations, 4 stations and 6 stations, which can clean 2-12-inch silicon wafers, potassium nitride, gallium arsenide, sapphire, semiconductor, LED, solar energy and other wet processes, including cleaning, drying, nitrogen drying and working chamber drying.
process parameters
process parameters time speed
Flushing (Type B) 0-999s 0-800r/min
Purging (type B) 0-999s 0-800r/min
Drying I (type B) 0-999s 0-800r/min
Drying II (type B) 0-999s 0-800r/min
Factory conditions
Voltage Single-cavity power Nitrogen pressure Nitrogen flow Pure water pressure Pure water flow Nitrogen interface Pure water interface Drainage caliber outlet diameter
AC380V/50Hz 5KW 0.25-0.4MPa 180-250L/min 0.2-0.3MPa 7-12L/L/min 3/8 3/8 DN32 DN110
Features
* Adopt PLC intelligent control to make all operation reliable and program intelligent.
* Adopt frequency conversion motor belt drive, low maintenance.
* Rotary shaft nitrogen seal, labyrinth design, to ensure that the chamber is isolated from the external environment during equipment operation.
* PTFE air control valve, clean pipe fittings.
* The main components are made of high-quality stainless steel SUS304. The internal frame is made of national standard stainless steel square steel, which is corrosion resistant and corrosion resistant. The appearance design is novel, humanized and easy to operate.
* The rotating mechanism is verified by precise dynamic balance, and the main frame is of load-bearing structure, which ensures the balance and stability of the system during operation, reduces the generation of vibration sources and greatly reduces the fragmentation rate.
* The top of the cover adopts imported silica gel heating auxiliary system, which is dry without dripping after drying.
* Electric heating system is adopted, with fast temperature rise, easy control and stable temperature.
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer DryingSrd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying

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