Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
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Product Highlights
- Wide Wafer Size Compatibility: Applicable to 2-12-inch production lines for silicon wafers and other materials.
- Low Fragment Rate: Achieves a fragment rate of 1/10000 through precise dynamic balance verification.
- Intelligent PLC Control: Adopts PLC intelligent control for reliable operation and program management.
- Vacuum Operation: Operates under vacuum conditions with inactive gas as the drying medium.
- Corrosion Resistant Materials: Main components made of SUS304 stainless steel with PTFE air control valves.
- Multi-Station Configuration: Available in 2, 4, or 6 stations to handle various wet process requirements.
- Stable and Reliable: Features low vibration design and continuous operational method for stability.
- Fast Temperature Rise: Electric heating system ensures fast temperature rise and stable control.
Product Attributes
- Customization
- Available
- After-sales Service
- 1 Year
- Warranty
- 1 Year
- Model NO.
- MDSD
- Movement Way
- Combined
- Atomization
- Rotary Atomization
- Flow
- Cross Flow
- Heating Mode
- Dielectric
- Material Status
- Solution
- Drying Medium
- Inactive Gas
- Operation Pressure
- Vacuum
- Operational Method
- Continuous
- Trademark
- minder-hightech
- Origin
- Guangzhou
- HS Code
- 8015809090
- Production Capacity
- 200PCS/Yearpcs/Year
Product Images of Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
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Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying -
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying -
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying -
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying -
Srd Wafer Dryer Spm Acid Cleaning, Organic Cleaning, Developing, Degumming Process Wafer Drying
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Product Description
MDSD wafer dryer
MDSD wafer dryer
Features
* Reasonable structure design and mature technology
*Simple operation, convenient maintenance, stable and reliable operation of the whole machine
* Low vibration, good reliability and large output
technical parameter
*Wafer size: applicable to 2-12-inch production line
*Fragment rate: 1/10000
application area
SPM acid cleaning, organic cleaning, development, degumming, ITO etching, BOE etching, uniform glue and other process wafer drying
Equipment function
The equipment is divided into 2 stations, 4 stations and 6 stations, which can clean 2-12-inch silicon wafers, potassium nitride, gallium arsenide, sapphire, semiconductor, LED, solar energy and other wet processes, including cleaning, drying, nitrogen drying and working chamber drying.
process parameters
| process parameters | time | speed |
| Flushing (Type B) | 0-999s | 0-800r/min |
| Purging (type B) | 0-999s | 0-800r/min |
| Drying I (type B) | 0-999s | 0-800r/min |
| Drying II (type B) | 0-999s | 0-800r/min |
| Voltage | Single-cavity power | Nitrogen pressure | Nitrogen flow | Pure water pressure | Pure water flow | Nitrogen interface | Pure water interface | Drainage caliber | outlet diameter |
| AC380V/50Hz | 5KW | 0.25-0.4MPa | 180-250L/min | 0.2-0.3MPa | 7-12L/L/min | 3/8 | 3/8 | DN32 | DN110 |
* Adopt PLC intelligent control to make all operation reliable and program intelligent.
* Adopt frequency conversion motor belt drive, low maintenance.
* Rotary shaft nitrogen seal, labyrinth design, to ensure that the chamber is isolated from the external environment during equipment operation.
* PTFE air control valve, clean pipe fittings.
* The main components are made of high-quality stainless steel SUS304. The internal frame is made of national standard stainless steel square steel, which is corrosion resistant and corrosion resistant. The appearance design is novel, humanized and easy to operate.
* The rotating mechanism is verified by precise dynamic balance, and the main frame is of load-bearing structure, which ensures the balance and stability of the system during operation, reduces the generation of vibration sources and greatly reduces the fragmentation rate.
* The top of the cover adopts imported silica gel heating auxiliary system, which is dry without dripping after drying.
* Electric heating system is adopted, with fast temperature rise, easy control and stable temperature.
About the Supplier
This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASR2311045". Items marked "
" are certified.
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Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Our chief technical expert comes from the School of Mechanical Engineering, South China University of Technology, and we are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.
We provide the equipment for semiconductor packaging factories and laboratories: Die bonder, Wire bonder, Glue encapsulate machine, Bond tester, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, etc.
We provide the equipment for semiconductor Fab factories and lab including: DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, and line of laboratory equipment.
We also provide the equipment for electronic and battery pack assembly plants: Soldering machine, Glue dispenser, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance welder etc.
We are engaged in the trade of microelectronic equipment and semiconductor equipment in Chinese Mainland, not only sell equipment, but also provide you with comprehensive professional solutions and after-sales services.
Until today, our brand's products have spread to major industrialized countries' factory and laboratories around the world, helping customers improve efficiency, reduce costs, and improve product quality.
About Our Factory & Business Background
- Address
- Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
-
Registered Capital
- 1,000,000 RMB
-
Terms of Payment
- T/T
-
International Commercial Terms(Incoterms)
- EXW
-
Average Lead Time
-
Peak Season Lead Time: one month
Off Season Lead Time: one month -
Nearest Port
- Shenzhen Port
Our Production Capability & Technical Expertise
- Main Products
- Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
-
R&D Engineers
- 1 people
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2014-12-30
- Export Year
- 2014-12-31
-
Main Markets
- North America, Europe
-
Overseas Agent/Branch
- No
FAQ
- What wafer sizes are supported?
- The dryer is applicable to 2-12-inch production lines.
- What is the warranty period?
- We provide a 1-year warranty and after-sales service.
- What materials can be processed?
- It processes silicon wafers, potassium nitride, gallium arsenide, sapphire, semiconductor, LED, and solar energy materials.
- What is the maximum fragment rate?
- The equipment achieves a low fragment rate of 1/10000.
- How many stations are available?
- The equipment is divided into 2, 4, and 6 stations.
- What is the lead time?
- The average lead time is one month for both peak and off-peak seasons.
- What is the payment term?
- The accepted payment term is T/T.
- What is the operation pressure?
- The equipment operates under vacuum pressure.
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