| After-sales Service: | 1 Year |
|---|---|
| Warranty: | 1 Year |
| Precision: | High Precision |
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Product Description
MD5090 fully automatic environmental protection inside diameter slicer is a special equipment for slicing various optical glass, semiconductor, crystal, ceramics, Nd-Fe-B, Sm-Co magnetic materials. The circular inner-edged diamond blade mounted on the spindle cutter is operated at high speed, and the table is controlled by the computer to move horizontally and longitudinally, and the material on the fixture is cut into the required product.
Application
Magnetic materials (NdFeB, SmCo, ferrite, niobium, etc.), optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, gemstone and other hard brittle materials
Technical parameters
| Maximum processing size (mm) | Φ95* 80 mm | |
| Cutting speed (cm2/mm) | 3-6 ((cm2/mm)) | |
| Sliced sheet balance deviation (mm) | ±0.005mm | |
| Cutting slice thickness (mm) | ≥0.30 | |
| Tolerance range (mm) of slices | ±0.015mm | |
| Lateral stroke (mm) | 120mm | |
| Longitudinal stroke (mm) | 100mm, longitudinal indexing range 0-100 grid, 0.01 per grid, 2mm per revolution | |
| Spindle electromechanical | 3-phase 1.1kw | |
| Spindle speed (r/min) | 2800rpm | |
| Work fixture adjustment | Horizontal angle | ±45º |
| Pitch angle | ±10º | |
| Vertical lift (mm) | 20 | |
| Cooling box volume (kg) | 50kg | |
| Bearing | HRB | |
| Power supply | 3-phase four-wire 50Hz 380V | |
| Dimension | 1030*830*1500mm | |
| Weight | 1000kg | |
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