| After-sales Service: | 1 Year |
|---|---|
| Certification: | CE |
| Warranty: | 12 Months |
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| project | Specifications | remarks |
Equipment Overview |
Equipment name: Fully auto uniform glue developing machine | |
| Equipment model: MD-2C2D6 | ||
| Processing wafer specifications: compatible with 4/6-inch standard wafers | ||
| Process flow of uniform glue: Flower basket slicing → centering → uniform glue (dripping → uniform glue → edge removal, back washing) → hot plate → cold plate → basket placing Development process flow: Flower basket slicing → centering → development (development solution → deionized water, back washing → nitrogen drying) → hot plate → cold plate → basket placing |
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| Overall size (approximately): 2100mm (W) * 1800mm (D) * 2100mm (H) | ||
| Chemical cabinet size (approximately): 1700(W) * 800(D) * 1600mm (H) | ||
| Total weight (approximately):1000kg | ||
| Workbench height: 1020 ± 50mm | ||
| Cassette unit | Quantity: 2 | |
| Compatible size: 4/6 inches | ||
| Cassette detection: microswitch detection | ||
| Slide out detection: Yes, reflective sensor | ||
robot |
Quantity: 1 | |
| Type: Double arm vacuum adsorption robot | ||
| Degree of freedom: 4-axis (R1, R2, Z, T) | ||
| Finger material: ceramic | ||
| Substrate fixation method: vacuum adsorption method | ||
| Mapping function: Yes | ||
| Positioning accuracy: ± 0.1mm | ||
| Centering unit | Quantity: 1 set | Optional optical alignment |
| Alignment method: mechanical alignment | ||
| Centering accuracy: ± 0.2mm | ||
Uniform glue unit |
Quantity: 2 sets (the following are configurations for each unit) | |
| Spindle rotation speed: -5000rpm~5000rpm | carrying idler | |
| Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm) | ||
| Minimum adjustment of spindle rotation speed: 1rpm | ||
| Maximum acceleration of spindle rotation: 20000rpm/s | carrying idler | |
| Dripping arm: 1 set | ||
| Photoresist tube route: 2 routes | ||
| Photoresist nozzle diameter: 2.5mm | ||
| Photoresist insulation: 23 ± 0.5 ºC | optional | |
| Moisturizing nozzle: Yes | ||
| RRC: Yes | ||
| Buffer: Yes, 200ml | ||
| Glue dropping method: center dropping and scanning dropping are optional | ||
| Edge removal arm: 1 set | ||
| Edge removal nozzle diameter: 0.2mm | ||
| Edge removal liquid flow monitoring: float flowmeter | ||
| Flow range of edge removal liquid: 5-50ml/min | ||
| Backwash pipeline: 2 ways (4/6 inch each with 1 channel) | ||
| Backwash flow monitoring: float flowmeter | ||
| Backwash fluid flow range: 20-200ml/min | ||
| Chip fixation method: small area vacuum adsorption Chuck | ||
| Vacuum pressure alarm: digital vacuum pressure sensor | ||
| Cup material: PP | ||
| Cup exhaust monitoring: digital pressure sensor | ||
Developing unit |
Shutter:yes | |
| Quantity: 2 sets (the following are configurations for each unit) | ||
| Spindle rotation speed: -5000rpm~5000rpm | carrying idler | |
| Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm) | ||
| Minimum adjustment of spindle rotation speed: 1rpm | ||
| Maximum acceleration of spindle rotation: 20000rpm/s | carrying idler | |
| Developing arm: 1 set | ||
| Developing pipeline: 2-way (fan-shaped/columnar nozzle) | ||
| Developer filtration: 0.2um | ||
| Developer temperature control: 23 ± 0.5 ºC | optional | |
| Developing solution flow range: 100~1000ml/min | ||
| Motion mode of the developing arm: fixed point or scanning | ||
| Fusing arm: 1 set | ||
| Deionized water pipeline: 1 circuit | ||
| Deionized water nozzle diameter: 4mm (inner diameter) | ||
| Deionized water flow range: 100~1000ml/min | ||
| Nitrogen drying pipeline: 1 circuit | ||
| Nitrogen nozzle diameter: 4mm (inner diameter) | ||
| Nitrogen flow range: 5-50L/min | ||
| Developer, deionized water, nitrogen flow monitoring: float flowmeter | ||
| Backwash pipeline: 2 ways (4/6 inch each with 1 channel) | ||
| Backwash flow monitoring: float flowmeter | ||
| Backwash fluid flow range: 20-200ml/min | ||
| Chip fixation method: small area vacuum adsorption Chuck | ||
| Vacuum pressure alarm: digital vacuum pressure sensor | ||
| Cup material: PP | ||
| Cup exhaust monitoring: digital pressure sensor | ||
Tackifying unit |
Quantity: 2 | optional |
| Temperature range: room temperature~180 ºC | ||
| Temperature uniformity: Room temperature~120 ºC± 0.75 ºC 120.1ºC~ 180ºC ± 1.5ºC (Remove 10mm from the edge, except for the ejector pin hole) |
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| Minimum adjustment amount: 0.1 ° C | ||
| Temperature control method: PID adjustment | ||
| PIN height range: 0-20mm | ||
| PIN material: body SUS304, PIN pin cap PI | ||
| Baking gap: 0.2mm | ||
| Overtemperature alarm: positive and negative deviation alarm | ||
| Supply method: Bubbling, 10 ± 2ml/min | ||
| Chamber operation vacuum: -5-20KPa | ||
Hot plate unit |
Quantity: 10 | |
| Temperature range: room temperature~250 ºC | ||
| Temperature uniformity: Room temperature~120 ºC± 0.75 ºC 120.1ºC~ 180ºC ± 1.5ºC 180.1ºC~250ºC ±2.0ºC (Remove 10mm from the edge, except for the ejector pin hole) |
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| Minimum adjustment amount: 0.1 ºC | ||
| Temperature control method: PID adjustment | ||
| PIN height range: 0-20mm | ||
| PIN material: body SUS304, PIN pin cap PI | ||
| Baking gap: 0.2mm | ||
| Overtemperature alarm: positive and negative deviation alarm | ||
| Cold plate unit | Quantity: 2 | |
| Temperature range: 15-25 ºC | ||
| Cooling method: constant temperature circulating pump cooling | ||
Chemical Supply |
Photoresist storage: pneumatic glue pump * 4 sets (Optional tank or electric glue pump) | |
| Glue dispensing volume: maximum 12ml per session, accuracy ± 0.2ml | ||
| Edge removal/back washing/RRC supply: 18L pressure tank * 2 (automatic replenishment) | ||
| Edge removal/back washing/RRC liquid level monitoring: photoelectric sensor | ||
| Photoresist liquid level monitoring: photoelectric sensor | ||
| Discharge of uniform adhesive waste liquid: 10L waste liquid tank | ||
| Developer supply: 18L pressure tank * 4 (Stored in the chemical cabinet outside the machine) | ||
| Deionized water supply: factory direct supply | ||
| Developing liquid level monitoring: photoelectric sensor | ||
| Developer waste discharge: factory waste discharge | ||
| Supply of tackifier: 10L pressure tank * 1, 2L pressure tank * 1 | ||
| Level monitoring of tackifier: photoelectric sensor | ||
control system |
Control method: PLC | |
| Human machine operation interface: 17 inch touch screen | ||
| Uninterruptible Power Supply (UPS): Yes | ||
| Set encryption permissions for device operators, technicians, administrators | ||
| Signal tower type: red, yellow, green 3 colors | ||
| System reliability indicators | Uptime: ≥95% | |
| MTBF: ≥ 500h | ||
| MTTR: ≤ 4h | ||
| MTBA: ≥24h | ||
| Fragmentation rate: ≤ 1/10000 | ||
| Other functions | Yellow light: 4 sets (position: above the glue mixing and development unit) | |
| THC: Yes, 22.5 ºC± 0.5 ºC, 45% ± 2% | optional | |
| FFU: Class 100, 5 sets (process unit and ROBOT area) | ||
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