Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine for RFID IC/to Package

• After-sales Service: 1 Year
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: MD-S818-R2R
• Driven Type: Electric
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Reel to reel wire ball bonder for RFID

Customization for reel to reel wire bonding for sim card

Speed:

21W/S for 2mm

Welding line area:56*80mm

Leadframe width:28-90mm

Application:

IC(SOP,SOT,DIP,BGA,COB.)

LED(SMD,COB)

Advantage:

Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption

The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution

0.1um,+/-2um(High resolution 0.1um worktable, + / - 2um

welding line accuracy

EFO(High resolution EFO

Full closed loop force control

2.5mil copper wire

Optional Automatic conversion of product types

Specification
Bonding Capability	48ms/w 2mm Wire Length
Bongding Speed	+/-2Ym
Wire Length	Max 8mm
Wire Diameter	15-65ym
Wire Type	Au,Ag,Alloy,CuPd,Cu
Bonding Process	/BSOB/BBOS
Looping Control	(Ultra Low Looping)<50ym
Bonding Area	56*80mm
XY(XY Resolution)	0.1um
(Ultrasonic Frequence)	138KHZ
(PR accuracy)	+/-0.37um
(Applicable Magazine)
(L)	120-305mm
(W)	36-98mm
(H	50-180mm
(Pitch	Min 1.5mm
(Applicable Leadframe
L	100-300mm
W	28-90mm
T	0.1-1.3mm
Conversion Time
Different Leadframe	<15min
Same Leadframe	<4min
Operation Interface
MMI Language	Chinese,Enghise
Dimension, Weight
Overall Dimension)W*D*H	950*920*1850mm
Weight	750KG
Facilities
Voltage	190-240V
Frequency	50Hz
Compressed Air	6-8Bar
Air Consumtion	80L/min

We have 16 years of experience in equipment,
and we can provide you with a one-stop IC Package Line Equipment solution !!