MDXN-25D Mask aligner Purpose and characteristics: This equipment is a precision lithography machine developed by our company specifically for the use characteristics of lithography machines in various colleges and research institutions.It is mainly used for the development and production of small and medium-sized integrated circuits,semiconductor components,optoelectronic devices,and surface acoustic wave devices. On the premise of maintaining the original main technical indicators of the equipment, we have optimized some structures and components of the equipment, reduced some unnecessary mechanical actions, and ensured that the failure points of the equipment are minimized as much as possible, and the operation of the equipment is also very stable and reliable.
Main technical parameters 1.Exposure type: single sided. 2.Exposure area:110×110mm. 3.Uneven exposure illumination: ≤±3%. 4.Exposure intensity:0-30mw/cm2 adjustable. 5.UV beam angle: ≤3°. 6.Central wavelength of ultraviolet light:365nm. 7.UV light source lifespan: ≥500 hours. 8.Adopting electronic shutter. 9.Exposure resolution:1 μm; 10.Microscopic scanning range:X:±15mm Y:±15mm; 11.Alignment range:X,Y adjustment±4mm;Q-direction adjustment±3°; 12.Engraving accuracy:1 μ The accuracy of the user's "version"and "chip"must comply with national regulations, and the environment,temperature,humidity,and dust can be strictly controlled.Imported positive photoresist is used,and the thickness of the uniform photoresist can be strictly controlled.In addition,the front and rear processes are advanced; 13.Separation amount;0~50 μm adjustable; 14.Exposure method:close exposure,which can achieve hard contact,soft contact,and micro force contact exposure; 15.Square finding formula:air
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