Aluminum Wire Chip Bonding Machine/Digital Tube Welding Machine/LED Packaging Equipment/Wire Bonding Machine/Wire Bonder

• After-sales Service: 1 Year
• Demoulding: Automatic
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Driven Type: Electric
• Specification: 280kg
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description
High-speed wire bonding machine
Ultra-quiet workbench, creating an excellent working environment
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers
CT3100
Speed: 5 wires/second
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )
CT3000
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
CT2300
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Shuttle 800B wire bonding machine
Fully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.
Specification

model	CT2300	CT3000	CT3100A
Z stroke	0.4"
Resolution	1μm
Wire feeding degree	30°	30° (45° optional)
Wire diameter	1.0-2.0 MIL	0.8-2.0 MIL	1.0-2.0 MIL
Bonding force	15-80 gm
Bonding power	0-2W adjustable
Bonding time	adjustable
Distance between	4.8 mm
Bonding head and base	Work stage
XY stroke	2"*2"	2"*2"	3"*3"
Rotary range	No limit
Base dimension	Max rotary R: 380mm
transducer	Light weight aluminum alloy
Process scan range XY	±1mm (Magnification 3.5 times)
Process scan range rotary	±15°
Optical system	2.5X process control
Storage	Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip
Voltage	2 phase 220V
Frequency	50/60 HZ
Power	800W
weight	240kg	270kg	280kg
size	1050*750*1400mm	630*700*1350mm	750*1050*1450mm

 

Bonding speed	50ms/wire for 2mm
Bonding accuracy	±3.0 μm
Wire length	Max.8mm
Wire diameter	15-50μm
Wire type	Au, Ag, Alloy, CuPd, Cu
Bond type	Single line /BSOB/BBOS
Loop control	Support ultra-low arc
Bonding area	56mm*65mm
XY resolution	0.1μm
Transducer system	138kHZ
PR accuracy	±0.37μm,±0.74μm
Applicable magazine	120-305*45-98*50-180mm
Magazine pitch	Min 1.5mm
Applicable lead frame	100-300*40-90*0.1-1.3mm
Different lead frame	<5min
Same lead frame	<15min
Operation interface	<4min
Overall dimension	Chinese/English
volume	950mm*920*1850mm
Weight	750kg
Voltage	190~240V
Frequency	50HZ
Compressed air	0.6-0.97bar
Air consumtion	80L/min

Sample
Product details
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