Semiconductor Industry Equipment Wafer Chip High Precision Reactive Ion Etching RIE Syste Inductive Coupling Plasma Etching ICP

• After-sales Service: Installation, Training
• Warranty: One Year Warranty
• Type: Electrical Etching Machine
• Model NO.: MH
• Object: Silicon-Based:Si/Sio2/Sinxsic
• Usage: Corrosion & Hollowed-out
• Certification: ISO9001: 2000, CE
• Etching Type: Reactive Ion Etching
• Precision: High Precision
• Condition: New
• Transport Package: Wooden Case
• Specification: 1170*750*1080mm
• Trademark: Minder-Hightech
• Origin: China
• Production Capacity: 10set/Month

Product Description

Product Description

 

Reactive ionomer etching machine

Item	MD150-RIE	MD200-RIE	MD200C-RIE
Product size	≤6 inches	≤8 inches	≤8 inches
RF power source	0-300W/500W/1000W Adjustable,automatic matching
Molecular pump	-/620(L/s)/1300(L/s)/Custom		Antiseptic620(L/s)/1300(L/s)/Custom
Foreline pump	Mechanical pump/dry pump		Dry pump
Process pressure	Uncontrolled pressure/0-1Torr controlled pressure
Gas type	H/CH4/O2/N2/Ar/SF6/CF4/ CHF3/C4F8/NF3/Custom (Up to 9 channels, no corrosive & toxic gas)		H2/CH4/O2/N2/Ar/F6/CF4/ CHF3/C4F8/NF3/Cl2/BCl3/HBr(Up to 9 channels)
Gas range	0~5sccm/50sccm/100sccm/200sccm/300sccm/500sccm/custom
LoadLock	Yes/No		Yes
Sample tem control	10°C~Room tem/-30°C~100°C/Custom		-30°C~100°C /Custom
Back helium cooling	Yes/No		Yes
Process cavity lining	Yes/No		Yes
Cavity wall tem control	No/Roomtem~60/120°C		Room tem-60/120°C
Control System	Auto/custom
Etching material	Silicon-based:Si/SiO2/SiNx··· IV-IV: SiC Magnetic materials/alloy materials Metallic material: Ni/Cr/Al/Au..... Organic material: PR/PMMA/HDMS/Organic film......		Silicon-based: Si/SiO2/SiNx...... III-V(3): InP/GaAs/GaN...... IV-IV: SiC II-VI (3): CdTe...... Magnetic materials/alloy materials Metallic material: Ni/Cr/A1/Au...... Organic material: PR/PMMA/HDMS /organic film...

Process result
Silicon-based material etching
Silicon-based materials, nano-imprint patterns, array
patterns and lens pattern etching

InP normal temperature etching
Pattern etching of InP based devices used in optical communication, including waveguide structure, resonant cavity structure ridge structure etc

SiC material etching
Suitable for microwave devices, power devices, etc


Physical sputtering, etching  Organic materiale tching

It is applied to the etching of difficult to etch materials such as some metals (such as Ni / Cr) and ceramics, and the patternede tching of materials is realized by physical bombardment.

It is used for etching and removal of organic compounds such as photoresist (PR)/ PMMA / HDMS / polymer

Cermet film material (Au/Ni/Cr/Al₂O₃)

Factory View:

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

Some of our clients:
Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.