Lab Semiconductor Device Silicon Aluminum Wire Chip Bonding Machine Heavy Wire Wedge Welding Wire Bonder

• After-sales Service: 1 Year
• Function: Wire Bonding
• Demoulding: Pull Core
• Model NO.: MDB-7550
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Manual
• Installation: Desktop
• Driven Type: Electric
• Mould Life: 300,000-1,000,000 Shots
• Transport Package: Wooden Case
• Trademark: Minder-hightech
• Origin: China
• Production Capacity: 10000

Product Description

Here we provide 3 types of most competitive manual wire bonder, thin aluminum wire wedge bonder(25-75um aluminum wire);heavy aluminum wire wedge bonder(75-500um aluminum wire);gold wire ball bonder(17-50um gold wire). they are very popular for samll quantity production, school, institution, research department.

1.Thin wire bonder MDB-2575:

Application:
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Electric requirement	220VAC±10%,50HZ,be sure connected to ground
wire diameter	25~75μm
ultrasonic power	0-3W, two channel. can be set separately of the two point
bond time	5-200ms,two channel
bond force	10-60g,two channel
span between first bond to second bond by automatic mode	0-10mm(motorized)
bond radian	0-6mm(motorized)
jig moving area	Φ16mm
mouse hand	20*20mm
digital camera	optional
dimension	600*560*390mm
weight	36kg

2:Heavy wire bonder MDB-7550:

Application:
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.

electric requiement	220VAC±10%,50HZ,be sure connected to ground
aluminium wire diameter	75~500μm (3~20mil)
ultrasonic power	0-30W, two channel.can be set separately of the two point
bond time	10-500ms,two channel
bond force	30-1200g,two channel
motorized Y	0-18mm
microscope rate	7.5 and 15
working area	Φ25mm
light	adjustable brightness
size	620×610×560mm
weight	~40kg

3:gold wire ball bonder MDBB-1750:

Application:
LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.

electric requiement	220VAC±10%,50HZ,be sure connected to ground
wire diameter	17~50μm
ultrasonic power	0-3W, two channel. can be set separately of the two point
bond time	0-200ms,two channel
bond force	35-180g,two channel
digital camera systerm	optional
min bonding time	0.4s/wire
span between first bond to second bond by automatic mode	more than 4mm.
length of terminal wire	0-2mm
ball dimension	2-4 times bigger setable
bond temperature	house temperature ~ 400°C
jig moving area	Φ25mm
microscope	15X,30X
dimension	700*460*550mm
weight	28kg

Application:


Customer useing:


Machine Real shooting:

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.