Manual Wafer Scriber 1.Equipment for scribing and splitting semiconductor substrates such as GaAs and Inp. 2.Can be used for R&D and mass production.
Features 1. The maximum wafer size that can be scratched is 8 inches. 2. The scratch width is ≤ 10μm. 3. The resolution is 1μm.
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ 1. About Price: All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample: We can provide sample production services for you, but you may provide some fees.
3. About Payment: After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery: After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging: After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty: Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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