Inner Diameter Cutting Machine for Semiconductor

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Glass Cutting Machine
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Inner Diameter Cutting Machine for Semiconductor
  • Inner Diameter Cutting Machine for Semiconductor
  • Inner Diameter Cutting Machine for Semiconductor
  • Inner Diameter Cutting Machine for Semiconductor
  • Inner Diameter Cutting Machine for Semiconductor
  • Inner Diameter Cutting Machine for Semiconductor
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Basic Info.

Model NO.
MD-IDC6080
Control
Artificial
Automation
Automatic
Precision
Precision
Certification
CE
Condition
New
Structure
Horizontal
Control System
PLC
Glass Washing Machine Type
Ultrasonic Glass Washing Machine
Glass Edging Machine Type
Glass Round Edging Machine
Grinding Head Number
4
Transport Package
Plywood
Specification
1000kg
Trademark
minderhightech
Origin
Zhejiang
Production Capacity
1000

Product Description

Inner Diameter Cutting Machine for SemiconductorInner Diameter Cutting Machine for SemiconductorInner Diameter Cutting Machine for SemiconductorInner Diameter Cutting Machine for SemiconductorInner Diameter Cutting Machine for SemiconductorInner Diameter Cutting Machine for Semiconductor
INNER CIRCLE SLICER
Details

    Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.
   Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating,  the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product. 
    We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. 
     For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time.

MD-IDC9580




Main technical parameters:
Max machining size(mm):φ95 ×80 mm
Cutting speed (cm²/mm):3-6(cm²/mm)
Degree of balance sheets by cutting deviation(mm):±0.005mm
Cutting film thickness(mm):≥0.30
The thin-cut tolerance(mm):±0.005mm
Horizontal stroke(mm):120mm
Longitudinal travel(mm):110mm
Spindle Electrical:3 Phase 0.75kw
Spindle Speed (r/min):2800Rev / min
Adjust the amount of work clamp:
Horizontal angle:±45º
Pitch angle of elevation:±10º
Vertically(mm):20
Cooling tank capacity(kg):50kg 
Cooling tank motor: 3 Phase 0.12kw 2780r/min
Power:Three-phase four-wire 50Hz 380V
Dimensions(mm):1130 ×850 ×1500
Weight(kg):~1400(kg)




Contact:
Guangzhou Minder-hightech Co.,ltd
No.1 Xingya 3rd road, Panyu district, Guangzhou, Ghina
contact: Shunyu Hu   
 
www.minder-hightech.con

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