LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Transport Package: Plywood Packing by Fast Express
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  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
  • LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine
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Basic Info.

Model NO.
MD
Specification
50kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
500/Year

Product Description

LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding MachineLED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding MachineLED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding MachineLED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Ultrasonic Manual Wire Bonding Machine

Application:

LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 
2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm 
15,weight:28kg 

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
 
 

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