ID Wafer Slicer MD-45s100d

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: Stone Polishing Machine
• Model NO.: MD-45S100D
• Control: Artificial
• Automation: Semi-automatic
• Precision: Normal Precision
• Certification: CE
• Condition: New
• Transport Package: 1000mm*1100mm*1600mm
• Specification: 1000mm*1100mm*1600mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description

Inner diameter slicer and optical edger

Product description:ID wafer Slicer MD-45S100D

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.
Main Features Spindle unit: It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.


MD-45S100D
  

Diameter of Cutting Ingot:	<¢100mm
Blade Standard:	φ422mm×φ152mm×0.15mm
Length of Cutting Ingot:	350mm
Cutting feeding speed:	1~99mm/min
Cutting Return Speed:	1~999mm/min
Stepping deviation of feeding system:	±0.007mm(testing with l mm feeding step)
Range of Wafer Thickness:	0.001~40.00mm
Adjustment of Crystal Direction:	Horizontal range(x)±7°(resolution:2')Vertical range(Y)±7º (resolution:2')
Power:	2.5kw ~380v±38v 50HZ±1HZ
Source of Air:	0.4~0.5MPa
Touching Panel:	5.7inch
Dimension:	1100mm*660mm*2230mm
Weight:	1100kg
Optional Solution:
¢422mDeep blade plate for Range of wafer thickness 58.000mm
¢457mm blade plate for range of ingot diameter maxma1¢105mm