III-V Semiconductor Materials Fabrication Die Separation Dicing Breaking Scribe Wafer Cleaving Equipment

• After-sales Service: 1 Year
• Function: Wafer Cleaving
• Demoulding: Automatic
• Model NO.: MD
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100000

Product Description

Wafer Cleaving Equipment
Application:
Application of III-V compound semiconductor materials, GaAS/II-V RFIC, Bio-Medical Chips, Silicon/MEMS, Sl Photonics, LEDS, Laser Diodes.

Suitable for compound semiconductor wafer materials such as GaAs, InP, etc. with a size of 6 inches or less, automatic cutting and cleavage specialized equipment. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.

Features:
Low COO, Robust Platform
High Precision Positioning
Vibration Free Stage Design
Automatic Processing
Advanced Software Functions
Accommodates Multiple Break/Process Modules
 

Cutting head	X direction	Travel range: 160mm	Roller pressure	0~100gf
		Positioning accuracy: 3 μ m	Knife pressure	0~20gf
	Y direction	Travel range: 160mm	Equipment weight	About 150kg
		Positioning accuracy: 3 μ m	Lens Y direction	Travel range:160mm
T direction		360 degree rotation	External dimensions	1170mmx730   mmx500mm
Wafer size		Suitable for 6-inch (150mm) wafers	Operation interface	23.8 "TFT color screen, Chinese interface
Image system		4.0X magnification (2.0X optional)	Control system	Windows 7 operating system, dedicated control software for cleavage machines
Standard configuration		Host \ Computer \ 23.8 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.