Dicing Saw Machine for Wafer Cutting High Percision CE

• After-sales Service: 1 Year
• Warranty: 1 Year
• Transport Package: Wooden Crate
• Specification: 665mm*850mm*1650mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

DS820--precision dicing machine
    DS820 The precision dicing machine is equipped with a 15-inch LCD touch screen, with a friendly GUI interface, and easy and convenient to align the workpiece; using the DS-300 software control system, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment has stable performance, high reliability, and maintenance cost Low.

Product parameter

Configuration and performance	Processing size	φ200mm or φ180mm
	Groove depth	<=4mm or customized
	Flatness of worktable	±0.005mm/100mm
	Alignment system	70*Straight light+Ring light (210*optional)
Spindle	range of rotation	10000~50000rpm
	Output Power	1.5KW
X axis	Drive way	servo motor
	Workbench left and right stroke	380mm
	Stroke resolution	0.001mm
	Speed setting range	0.1~400mm/s
Y axis	Drive way	Stepping motor + grating closed loop control system
	Spindle back and forth stroke	210mm
	Stroke resolution	0.0005mm
	Single-step positioning accuracy	<=0.003mm/5mm
	Full positioning accuracy	<=0.005mm/210mm
Z axis	Drive way	Stepper motor
	Spindle up and down stroke	30mm
	Stroke resolution	0.001mm
	Repeatability	0.001mm
θ axis	Drive way	DD motor
	Angle range	380º
	Angle resolution	0.0005º
Basic specifications	power supply	Single phase, AC220±10%, 3.0kVA
	power consumption	0.6KW during processing (reference value)
		When warming up 0.4KW (reference value)
	Compressed air	Pressure 0.5~0.6Mpa, maximum consumption 180L/min
	Cutting water	Pressure 0.2~0.3Mpa, maximum consumption 3.0L/min
	Cooling water	Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
	Exhaust volume	2.0m³/min(ANR)
	Dimensions W×D×H	775mm*960mm*1650mm
	weight	600kg

DS830--precision dicing machine
DS830 The precision dicing machine is equipped with an imported 1.5kw high-speed spindle; driven by the θ-axis DD motor, the accuracy of the rotation angle, the resolution of the rotation angle, and the flatness of the table are improved; the power distribution system is upgraded, and multiple functions can be selected according to customer needs.

Product parameter

Configuration and performance	Processing size	φ200mm or φ180mm
	Groove depth	<=4mm or customized
	Flatness of worktable	±0.005mm/150mm
	Alignment system	70x straight light+ring light (210+optional)
Spindle	range of rotation	10000~50000rpm
	Output Power	1.5KW (2.4KW optional)
X axis	Drive way	servo motor
	Workbench left and right stroke	380mm
	Stroke resolution	0.001mm
	Speed setting range	0.1~500mm/s
Y axis	Drive way	Stepping motor + grating closed loop control system
	Spindle back and forth stroke	210mm
	Stroke resolution	0.0005mm
	Single-step positioning accuracy	<=0.003mm/5mm
	Full positioning accuracy	<=0.005mm/210mm
Z axis	Drive way	Stepper motor
	Spindle up and down stroke	30mm
	Stroke resolution	0.001mm
	Repeatability	0.001mm
θ axis	Drive way	DD motor
	Angle range	380º
	Angle resolution	0.0002º
Basic specifications	power supply	Single phase, AC220±10%, 3.0kVA
	power consumption	0.6KW during processing (reference value)
		When warming up 0.4KW (reference value)
	Compressed air	Pressure 0.5~0.6Mpa, maximum consumption 220L/min
	Cutting water	Pressure 0.2~0.3Mpa, maximum consumption 3.5L/min
	Cooling water	Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
	Exhaust volume	2.0m³/min(ANR)
	Dimensions W×D×H	775mm×960mm×1650mm
	weight	600kg

Features:
√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions
Conditions of Use:
1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the cutting water temperature to room temperature + 2°C (fluctuation range within ±1°C), and the cooling water temperature to be the same as room temperature (fluctuation range within ±1°C).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.

Application fields: optical optoelectronics, communication, triode, IC, LED, NTC, photovoltaic, medical equipment, scintillation crystal
Precision cutting materials: blue glass, silicon wafer, gallium arsenide, lithium niobate, alumina, ceramics, quartz, sapphire, crystal, PCB board
Multi-chip cutting function:
For multiple square processed objects, register their positions in the system respectively to realize the alignment and cutting of multiple processed objects.
Accessories Consumables

Brand customers
Well-known company
Colleges and universities
Factory