| After-sales Service: | 1 Year |
|---|---|
| Warranty: | 1 Year |
| Condition: | New |
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SPECIFICATION
| Bond Head and Table | ||
| XYtravel | 4"X4"(LED) | |
| θ | +/- 360° | |
| Ztravel | 0.4" | |
| Resolution | 0.02 mil | |
| Bond angle | 30° | |
| Wire Size | 0.7 mil -2.0 mil | |
| Bond force | 15-200gm(programmable) | |
| Bond Power | 0-2watt(programmable) | |
| Bond time | programmable | |
| Bond head clearance | 4.8mm | |
| F/T resolution | programmable | |
| Bonding Throughput | UPH 14K | |
| ( based on 2 mm wire length) | ||
| Transducer and Power Unit | ||
| Transducer | Aluminum alloy light weight type | |
| Power generator | Auto-Cal ultrasonic generator | |
| Alignment Reference | ||
| Die | 0,1 or 2 points | |
| Substrate | 0.1 or 2 points | |
| PR System | ||
| Programmable search range | ||
| XY | ±1mm(Magnification 3.5X) | |
| θ | ±15"@1"Resolution Satio | |
| Accuracy | ±1/4 pixel (±1u m,3.5X Optics) | |
| PR time | 20ms | |
| Optics | ||
| Microscope | 10-30X,2-speed zoom | |
| Power Supply | ||
| Voltage | 110/220V±5% | |
| Frequency | 50/60HZ | |
| Power consumption | 800W(Max) | |
| Program Storage Capacity | ||
| NO.of programs 99 | ||
| 1000 chips/program | ||
| 1000 wires/chip | ||
| Dimensions and Weight | ||
| Weight | 280Kg | |
| Size(DxWxH) | 760x820x1450mm | |
Packing & Delivery
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