Micro LED Mini LED Semiconductors Mems RF Microwave Full-Function Desktop Automatic Die Bonding Die Attach Eutectic Crystal Planting Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MD
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

Full-Function Desktop Automatic Die Bonding Machine


The Full-Function Desktop Automatic Die Bonding and Placement System is a comprehensive laser vision-based micro-assembly solution for high-precision die bonding. It effectively addresses user demands for compact footprint and high-precision processes. With a modular design, flexible configuration, and easy operation, the core module integrates a high-precision force-controlled mounting system and a dispensing fixture system. The system uses a micron-level gantry structure with single and dual drives, allowing easy integration with other modules for various configurations.
This system is widely used in various fields, including electronic devices (Micro LED, mini LED display chips, next-generation mobile devices with 03015 and 008004 components, large medical equipment (core imaging module assembly), optical devices (laser LD Palladium bar assembly, VCSEL, PD, LENS, etc.), and semiconductors (MEMS devices, RF devices, microwave components, and hybrid circuits).


Key Features

• Desktop High-Precision Multi-Function Placement and Dispensing Platform
• AI Flatness Calibration System on the placement and dispensing platform, greatly reducing issues such as voids in die bonding.
• Precision Force-Controlled Soft Landing System: Ensures minimal contact force, preventing damage to the chip or leaving marks on it, perfectly solving defects caused by traditional pneumatic control systems and improving throughput.
• Supplementary Modules: Features automatic needle adjustment (fully automated calibration) and automatic needle tip change (supports 2-3 types of products), with auto calibration completed in less than 3 minutes.
• High-Precision Bonding for Small-Batch Production and Experiments: Meets the needs of both high-precision experimental bonding and small-batch production.

Project	Content	Specification
Platform System	X-Axis Stroke	300mm
	Y-Axis Stroke	300mm
	Z-Axis Stroke	50mm
	T-Axis Stroke	360°
	Mounting Device Size	0.15-25mm
	Tooling Range	180*180mm
	XY Drive Type	Servo
	Maximum XY Running Speed	XYZ = 50mm/s
	Limit Function	Electronic soft limit + physical limit
	Laser Height Measurement Precision	3μm
	Needle Calibration Module Accuracy	3μm
	Platform Structure	Dual Y optical platform
Placement System	Overall Placement Accuracy	±10μm
	Adhesive Force Control	10g-80g
	Placement Orientation	Different heights, different angles
	Suction Nozzles	Bakelite suction nozzle / rubber suction nozzle
	Placement Pressure	0.01N-0.1N (10g-100g)
	Production Efficiency	Not less than 180 components/hour (for 0.5mm x 0.5mm chip size)
Dispensing System	Minimum Dispense Dot Diameter	0.2mm (using 0.1mm aperture needle)
	Dispensing Mode	Pressure-time mode (standard machine)
	High-Precision Dispensing Pump and Control Valve	Automatically adjustable positive/negative pressure based on the path feedback
	Dispensing Air Pressure Range	0.01-0.5MPa
	Support for Dot Dispensing Function	Parameters can be set freely (including dispensing height, pre-dispense time, dispensing time, pre-retract time, dispensing air pressure, etc.)
	Support for Scraping Function	Parameters can be set freely (including dispensing height, pre-dispense time, scraping speed, pre-retract time, scraping air pressure, etc.)
	Dispensing Height Compatibility	Capable of dispensing at different heights, with the adhesive shape adjustable to any angle
	Customizable Scraping	Adhesive library can be directly accessed and customized
Vision System	XY Repetition Positioning Accuracy	5μm
	Z Repetition Positioning Accuracy	5μm
	Upper Vision System Resolution	3μm
	Lower Vision System Resolution	3μm
	Needle Contact Sensor	5μm
Product Applicability	Device Types	Wafer, MEMS, Infrared Detectors, CCD/CMOS, Flip Chip
	Materials	Epoxy resin, silver paste, thermal conductive adhesives, etc.
External Dimensions	Weight	Approx. 120KG
	Dimensions	800mm × 700mm × 650mm (approx.)
Environmental Requirements	Input Power	220AC ± 5%, 50Hz, 10A
	Compressed Air (Nitrogen) Supply	0.2MPa ~ 0.8MPa
	Temperature Environment	25°C ± 5°C
	Humidity Environment	30% RH ~ 60% RH

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.