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Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System

Name: Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: pFAaXSmMZbTO
Price: 50000.00 USD
Availability: InStock

Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System pictures & photos

After-sales Service:	1 Year
Condition:	New
Speed:	High Speed
Precision:	Precision
Certification:	CE
Warranty:	12 Months

Samples:	US$ 100/Piece 1 Piece(Min.Order) \| Request Sample

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