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Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine
On-Site Scanning
Precise Digital Duplicate
Angle Unlimited
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Reference FOB Price
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US $9,999.00-99,999.00
/ Piece
|
1 Piece
(Min. Order)
After-sales Service:
1 Year
Condition:
New
Speed:
High Speed
Precision:
High Precision
Certification:
CE
Warranty:
12 Months
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