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Multi-Chip High Precision Glue Dispensing Die Bonding Process Heating Eutectic Dual Drive Gantry System Die Bonder Automatic Eutectic Patch

Name: Multi-Chip High Precision Glue Dispensing Die Bonding Process Heating Eutectic Dual Drive Gantry System Die Bonder Automatic Eutectic Patch
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: bwkGIKPlLeTd
Price: 9999.00 USD
Availability: InStock

Multi-Chip High Precision Glue Dispensing Die Bonding Process Heating Eutectic Dual Drive Gantry System Die Bonder Automatic Eutectic Patch pictures & photos

After-sales Service:	1 Year
Condition:	New
Speed:	High Speed
Precision:	High Precision
Certification:	CE
Warranty:	12 Months

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