Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Light Source Environment: Yellow Light
Diamond Member Since 2017

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  • Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner
  • Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner
  • Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner
  • Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner
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  • Overview
  • Product Description
  • Equipment structure diagram
  • Product Parameters
Overview

Basic Info.

Model NO.
MCXJ-MLS8
Temperature
22ºC±2ºC
Humidity
50%±10%
Cleanliness
1000
Internet
One Network Port
Device Weight
1500kg
Transport Package
1300*1100*2100mm
Specification
1300*1100*2100mm
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Product Description

This "MCXJ-MLS8 Technical Specification" stipulates the specifications, configuration, technical requirements, acceptance methods and standards, installation and training plans, equipment basic facility requirements, parts and consumables, after-sales service, etc. of the products, systems and services provided by Macex, as the customer and MACEX on the MCXJ-MLS8 laser direct imaging equipment customer site test and acceptance standards, the test will be jointly carried out by the customer and representatives of MACEX Company at the customer site, and check the test results together.

Equipment structure diagram

Semiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless AlignerSemiconductor Device Fabrication Fab Wafer Mcxj-Mls8 Maskless Lithography System Lithography Maskless Aligner

Product Parameters
No. Environment Require
1 Light source environment Yellow light
2 Temperature 22ºC±2ºC
3 Humidity 50%±10%
4 Cleanliness 1000
5 CDA 0.6±0.1Mpa,200LPM, dry, clean air
6 Power supply 220~240V,50/60Hz,2.5KW;The ground wire must be grounded,
7 Cooling water Temp.:10ºC~ 20ºC
Pressure:0.3MPa ~ 0.5MPa
Flow rate:20L/min
Pressure difference:0.3MPa
Take over caliber:Rc3/8
8 Venue level:±3mm/3000mm shake:VC-B Bearing:750
10 Internet One network port
11 Machine size 1300*1100*2100mm
12 Device weight 1500kg
 
No. Project Spec. Remark
1 Resolution 0.6um AZ703,AZ1350
2 CDU ±10%@1um  
3 Substrate thickness 0.2mm~4mm  
4 Date grid accuracy 60nm  
5 Overlay ±500nm 130mmx130mm
6 Stitching accuracy ±200nm AZ703
7 MAX exposure size 190X190mm  
8 Throughput 300mm2/min 50mj/cm2;
9 light source LD  375nm  
10 light power 6W  
11 Energy uniformity ≥95%  
12 light life 10000hr  

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