Semiconductor Wafer Surface Precision Chemical Mechanical Planarization CMP

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: CMP
• Model NO.: MD
• Control: CNC
• Automation: Automatic
• Precision: High Precision
• Application: CMP
• Type for Grinding Machine: CMP
• Grinding Machine Type: CMP
• Grinding Method: CMP
• Certification: CE
• Condition: New
• Transport Package: Woodern Case
• Trademark: MINDER-HIGHTECH
• Origin: China
• Production Capacity: 1000

Product Description

Chemical mechanical planarization (CMP) process

Precision CMP equipment achieves efficient removal of excess materials on wafer surfaces and global nanoscale planarization through the synergistic effect of chemical corrosion and mechanical grinding.

Multi purpose chemical polishing machine, specifically designed for CMP and coating polishing applications that require strict geometric accuracy and surface quality, can achieve sub nanometer level Ra.
This device can perform precise nanometer level polishing on individual molds, as well as polishing thin sheets with diameters up to 8 inches. In addition, it can also be used in non-traditional polishing applications such as hard substrate polishing, Epi surface preparation, and chip recycling improvement.
An optional independent water tank can be used to transport and store polishing solution, deionized water, or other liquids. These liquids can be used for spray cleaning of chips and molds before moving the sample away from the processing area. This water tank can be connected to the CDP host, providing convenient options for users who do not have containers or conveying systems indoors.
In order to adapt the CDP series machines to various materials and process requirements, technicians customize and design corresponding polishing templates according to user technical requirements to accurately meet CMP process requirements. The left image shows the range of a single wafer with a diameter of 8 inches.
In order to ensure precise measurement and control of wafers or devices polished on CDP machines, we have developed an EPD system, whose custom designed CDP scanning graphics program can run on laptops. This program monitors and graphically depicts the polishing process, and automatically stops once the endpoint is reached.

By adjusting the main CMP process parameters, the ACP system can be parameterized. After conducting more than 10 tests on the same material, the results showed that the repeatability of WIWNU and WTWNU could be maintained below 3%. The ACP system provides users with professional CMP process solutions based on different materials, reducing wafer surface defects and significantly improving wafer yield.
The ACP system can be better used in a wide range of applications, and the chart shows the CMP process test results for silicon oxide, copper, silicon nitride, aluminum copper, silicon germanium, and tungsten.
The chart shows that after CMP process, WTWNU can reach 2.82%

Application:
Silicon wafer planarization
II-V compound planarization
Oxide planarization
Flattening of infrared material substrate
Sapphire, gallium nitride, and silicon carbide substrate planarization, EPI substrate planarization
Thinning SOS and SOI wafers to below 20 microns
Hierarchical reverse engineering or FA applications

Power supply	220v 10A
Wafer size	4"/100mm 6"/150mm 8"/200mm 12"/300mm
Working disk diameter	520mm,780mm
Working disk speed	0-120rpm
Fixture speed	0-120rpm
Fixture swing frequency	0-30spm
Wafer back pressure	0-150psi
Pressure at the center point of the wafer	0-50psi
Timed Time	0-10 h
Feed channel	≥2
Feed speed	0-150ml/min

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.