Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol

Product Details
After-sales Service: 1 Year
Demoulding: Automatic
Condition: New
Diamond Member Since 2017

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  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
  • Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
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Basic Info.

Model NO.
MDXN-43D4
Certification
ISO, CE
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Crate
Specification
200kg
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol BeolSemiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol BeolSemiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
MDXN-43D4 High precision mask aligner


Purpose and characteristics:
This equipment is designed according the needs of market. Can do substrate below 100*100mm. it suitable for one time exposure product. Can do like sound surface component, thyristor, LCD, sensor, diode..etc. can provide square or round substrate holder, which thickness below 1 mm. (can customize thicker)
Semiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol BeolSemiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol BeolSemiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol BeolSemiconductor Device Fabrication Fab Wafer Fabrication Mdxn-43D4 High Precision Mask Aligner Lithography Machine Feol Beol
Main technical parameters
1. Operation : Manual.
2. Exposure type: contact single side one time exposure     
3. Exposure area: 110X110mm; with 4inch LED exposure head, one year warranty.
4. Central wavelength of ultraviolet light: 365nm; 
5. Substrate thickness: ≤1mm . UV beam angle: ≤ 3 °
6. Exposure resolution: 1 μ M
7. Exposure uniformity: ≥ 97%;
UV light source lifespan: ≥ 20000 hours;(2 years warranty)
8. Sample dimension: Φ102mm;Φ76mm  Adopting electronic shutter;
9. Exposure intensity: 0-30mw/cm2 adjustable;
10.Power: 220V 50Hz 1.5kw.
22.air source: >0.4Mpa
23.Vacuum degree: -0.07MPa~-0.09Mpa
24.dimension:75*75*170cm  160kg
 

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