Semiconductor Device Fabrication Wafer Fab Chips Quick Polish Mass Production Lapping and Polishing System

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: Stone Polishing Machine
• Model NO.: MDAM-CMPA200
• Control: CNC
• Automation: Automatic
• Precision: High Precision
• Application: Wafer
• Type for Grinding Machine: Special Grinding Machine
• Grinding Machine Type: Vibration Polishing Machine
• Certification: CE
• Condition: New
• Transport Package: Wooden Case
• Trademark: minder-hightch
• Origin: China
• Production Capacity: 1000

Product Description

MDAM-CMPA200
Mass Production Lapping And Polishing System

The functional parameters of the equipment controlled by an independent remote control system. The remote control system can choose wireless or wired mode to control the host according to the specific requirements of the user's process. The control system can choose the distance independent of the equipment host according to the user's process requirements. This configuration not only improves the protection level of the health and safety of the operators in the chemical polishing process, but also avoids the corrosion of the operation control system by the polishing fluid waste generated in the polishing process.
MDAM-CMPA200 grinding and polishing equipment has equipment timing function, which can work continuously for 10 hours. At the same time, the equipment has the function of preset working hours. When the preset time is reached, the equipment will automatically stop, which greatly improves the automation function of the equipment and the process standardization operation.

Equipment Functions
1.MDAM-CMPA200 is an ideal grinding and polishing system for high-volume grinding and polishing of various material wafers (SiC, Sapphire, GaN, AlN...) components, such as filter materials, wedge materials, LCD panels, etc.
2.Four motor drives and four extra-large polishing heads allow up to 48 2" wafers to be polished simultaneously. Therefore, the MP series machine is ideal for use in a full-load production environment.
3.The machine's automatic control panel uses a portable touch screen control, and process parameters can be freely entered and changed.
4.Automatic control and intelligent loading/unloading systems can quickly polish wafers to epitaxial preparation surfaces. This system is particularly useful for the operation of hard substrate materials, and it can also operate wafers up to 8" ø.
5.MDAM-CMPA200 precision grinding and polishing machine includes a host, remote control system, fixture, vacuum system, filler system, grinding and polishing discs, etc.
6.MDAM-CMPA200 precision grinding and polishing machine, the host and all spare parts are made of highly corrosion-resistant materials, the whole machine is corrosion-resistant, and is suitable for chemical mechanical grinding and polishing of various semiconductor materials.
7.Through an independent remote control system, multi-machine joint control can also be achieved. Through a control terminal, multiple grinding and polishing machines can be controlled, which is convenient for changing process parameters during the process. It can also achieve precise numerical control of multiple processes at the same time, greatly improving work efficiency and process accuracy.
8.The automatic filling system can adjust the dripping speed according to different process requirements, and automatically shut down when the abrasive is used up to prevent damage to the sample when there is no abrasive.
9.The equipment control system has a timing function. After the preset time is reached, the system automatically shuts down.

Equipment Features
1.Independent remote control system, remote control.
2.Multi-computer joint control can be realized in one control terminal.
3.On-line real-time grinding and polishing disc temperature control and cooling function.
4.Multi-channel feeding system.
5.Grinding, polishing and disc washing function.
6.The system is equipped with universal wheel with locking function, which is convenient for moving and fixing.

Equipment advantages
1. Reduce polishing time, each polishing head has a load of 0-50Kg, and the polishing time can be reduced by 70%.
2. Multifunctional and diverse, it can polish a variety of materials, which is enough to provide higher efficiency and production capacity for high-precision polishing, and different polishing templates can be made according to the exact requirements of users to achieve the best results.
3. High output can polish up to 48 2-inch wafers at a time.
4. Convenient and simple automatic panel control for operation and maintenance. All parameter settings are operated on the panel, which is simple and clear. It is also equipped with an intelligent loading/unloading system for easy operation.
5. Easy to move, the entire system is placed using universal wheels with locking function, which is convenient for fixing and moving.
6. The equipment has the function of real-time online monitoring of the surface shape of the grinding and polishing disc during the process, and can trim the surface shape of the grinding and polishing disc in real time online. The disc surface shape control accuracy is 1um.






Applicable Materials
1. Silicon-based materials (Si, a-Si2, poly Si)
2. III-V materials (GaAs, InP, GaSb, InSb, etc.)
3. Third-generation semiconductor materials (SiC, GaN, etc.)
4. Fourth-generation semiconductor materials (Diamond, Ga2O3, etc.)
5. Infrared materials (CZT, MCT, etc.)
6. Photoelectric materials (LiNbO3, LiTaO3, SiO2, etc.)
7. Metal materials (Au, Cu, Al, Mo, TC4, etc.)
8.MEMS
9.Semiconductor device
10.Semiconductor substrate
11.Encapsulation

Achievable Industrial Index
 1. The total thickness deviation (TTV) of φ50mm wafer is within ±1μm;
2. The total thickness deviation (TTV) of φ75mm wafer is within ±2μm;
3. The total thickness deviation (TTV) of φ100mm wafer is within ±3μm;
4. The total thickness deviation (TTV) of φ150mm wafer is within ±4μm;
5. The total thickness deviation (TTV) of φ200mm wafer is within ±5μm.

Number of fixtures	4 stations
Power supply	220V50Hz
Total power	3.5 KW
Diameter of large plate	760 mm
Plate rate	Maximum 120rpm
Clamp swing angle	Maximum 10 degrees
Up and down lifting distance	100mm
Clamp speed	Maximum 80rpm
Clamp size	Maximum 208mm
Wafer fixing method	Vacuum adsorption
Clamp vacuum branch	Maximum 4 channels
Clamp down pressure	0-50 Kg
Drum	4
Peristaltic pump	4
Display screen	12.1 inches
Demand air pressure	Greater than 7 bar
Vacuum	Need
Pure water	Need
Cleaning water gun	Yes
Cleaning air gun	Yes
Door opening method	Front and rear doors
Table top door panel	Fully transparent

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.