• Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
  • Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
  • Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
  • Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
  • Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
  • Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven

Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven

After-sales Service: 1 Year
Condition: New
Certification: CE
Warranty: 24 Months
Automatic Grade: Automatic
Installation: Desktop
Diamond Member Since 2017

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Basic Info.

Model NO.
MDVES400
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven
1
,Application

IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.

2Product description

The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.

3,Features

1. MDVES400 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;
2. The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;
3. Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized; 4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell;

4,Specification

structure size
Basic frame 1260*1160*1200mm
Maximum height of base 90mm
Observation window include
Weight 350KG
Vacuum system
Vacuum pump Vacuum pump with oil pollution filtering device optional dry pump
Vacuum level Up to 10Pa
Vacuum configuration 1. Vacuum pump
2. Electric valve
Pumping speed control The pumping speed of the vacuum pump can be set by the host computer software
Pneumatic system
Process gas N2, N2 / H2 (95% / 5%), HCOOH
First gas path Nitrogen/nitrogen-hydrogen mixture (95%/5%)
Second gas path HCOOH
Heating and cooling system
Heating method Radiant heating, contact conduction, heating rate 150ºC/min
Cooling method Contact cooling, the maximum cooling rate is 120ºC/min
Hot plate material copper alloy, thermal conductivity: 200W/m·ºC
Heating size 420*320mm
Heating device Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech.
Temperature range Max 450ºC
Power requirements 380V, 50/60HZ three-phase, maximum 40A
Control System Siemens PLC + IPC
Equipment power
Coolant Antifreeze or distilled water
20ºC
Pressure: 0.2~0.4Mpa
coolant flow rate >100L/min
Water tank water capacity 60L
Inlet water temperature 20ºC
Air source 0.4MPaair pressure0.7MPa
Power supply single-phase three-wire system 220V, 50Hz
Voltage fluctuation range single phase 200~230V
Frequency fluctuation range 50HZ±1HZ
Equipment power consumption about 18KW; grounding resistance 4Ω;

5,Standard configuration

Host system including vacuum chamber,main frame, control hardware and software
Nitrogen pipeline Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline Bringing formic acid into the process chamber via nitrogen
Water cooling pipeline cooling the upper cover, lower cavity and heating plate
Water cooler Provide continuous water cooling supply to equipment
Vacuum pump Vacuum pump system with oil mist filtration

6,Operation Conditions

Temperature 10~35ºC
Relative humidity 75%
The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals.
Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering OvenSingle Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering OvenSingle Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering OvenSingle Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering OvenSingle Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering OvenFAQ
Q: How to buy your products ?
A: We have some products in stock , you can take away the products after you arrange the payment ;

If we don't have the products in stock you want, we will start production once getting the payment.
Q: What's the warranty for the products ?
A: The free warranty is one year from the date of commissioning qualified.
Q: Can we visit your factory ?
A: Of course, welcome to visit our factory if you come to China.
Q: How long is the validity of quotation ?
A: Generally, our price is valid within one month from the date of quotation. The price will be adjusted appropriately as the
price fluctuation of raw material in the market.
Q: What's the production date after we confirm the order ?
A: This depends on the quantity. Normally, for the mass production, we need about one week to finish the production.


Please contact us for more detail information.

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