Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol

Product Details
After-sales Service: 1 Year
Demoulding: Automatic
Condition: New
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
  • Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
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Basic Info.

Model NO.
MDXN-31D4
Certification
CE
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Driven Type
Electric
Transport Package
Wooden Crate
Specification
200kg
Trademark
minder-hightech
Origin
China
Production Capacity
1000

Product Description

MDXN-31D4 High precision double-sided lithography machine

Purpose and characteristics:
This equipment is mainly used for the development and production of small and medium-sized integrated circuits, semiconductor components, and surface acoustic wave devices. Due to the advanced leveling mechanism and low leveling force, this machine is not only suitable for the exposure of various types of substrates, but also for the exposure of easily fragmented substrates such as potassium arsenide and phosphate steel, as well as the exposure of non circular and small substrates.
Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol

Main technical parameters:
1. Exposure type: contact type, plate alignment, double-sided single exposure
2. Exposure area: 110X110mm;
3. Exposure uniformity: ≥ 97%;
4. Exposure intensity: 0-30mw/cm2 adjustable;
5. UV beam angle: ≤ 3 °
6. Central wavelength of ultraviolet light: 365nm;
7. UV light source lifespan: ≥ 20000 hours;;
8. Working surface temperature: ≤ 30 ºC
9. Adopting electronic shutter;
10. Exposure resolution: 1 μ M (exposure depth is about 10 times the line width)
11. Exposure mode: Double sided simultaneous exposure
12. Alignment range: x: ± 5mm Y: ± 5mm
13. Plate alignment accuracy: 2 μ m
14. Rotation range: Q-direction rotation adjustment ≤ ± 5 °
15. Microscopic system: dual field of view CCD system, objective lens 1.6X~10X, computer image processing system, 19 "LCD monitor; Total magnification 91-570x
16. Mask size: Capable of vacuum absorbing 5 "square masks, with no special requirements for the thickness of the mask (ranging from 1 to 3mm).
17. Substrate size: Suitable for 4 "substrates, with substrate thickness ranging from 0.1 to 2mm.
18. When ordering, there are no special requirements, and a 5 "X5 shelf is standard; you can customize shelves below 5" X5:
Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Feol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner BeolFeol Semiconductor Device Fabrication Wafer Fabrication Mdxn-31d4 High Precision Double-Sided Lithography Machine Mask Aligner Beol

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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