ID Wafer Slicer MD-45s153b

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Stone Polishing Machine
Diamond Member Since 2017

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Registered Capital
1000000 RMB
  • ID Wafer Slicer MD-45s153b
  • ID Wafer Slicer MD-45s153b
  • ID Wafer Slicer MD-45s153b
  • ID Wafer Slicer MD-45s153b
Find Similar Products
  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
MD-45S153B
Control
Artificial
Automation
Semi-automatic
Precision
Normal Precision
Certification
CE
Condition
New
Transport Package
1000mm*1100mm*1600mm
Specification
1000mm*1100mm*1600mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description

ID Wafer Slicer MD-45s153b

Inner diameter slicer and optical edger

Product description:ID wafer Slicer MD-45S153B

ID Wafer Slicer MD-45s153b

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.
Main Features Spindle unit: It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.

ID Wafer Slicer MD-45s153b
MD-45S153B
 Diameter of Cutting Ingot: ¢153mm
Blade Standard: ¢690mm×¢241mm×0.15mm or ¢690mm× ¢235mm×0.15mm
 Length of Cutting Ingot: 400mm
Cutting speed: 0.2~99mm/min
Return Speed: 1~1000mm/min
The speed of main spindle: 1420r/min
Stepping deviation of feeding : ±0.005mm(testing with l mm feeding step)
Range of Wafer Thickness: 0.001~68.00mm
Adjustment only of Crystal Direction: 0.001mm
Adjustment of Crystal Direction: Horizontal range(x)±7°(resolution:2') Vertical range(Y)±7º(resolution:2')
Power: 3.5kw,~380v±38v, 50HZ±1HZ
Source of Air: 0.4~0.5MPa,250L/min(instantaneous flux when braking)
Sour of cooling water: 0.2~0.4mpa;5L/min
Touching Panel: 7.7inch
Dimension: 645mm*925mm*2820mm
Weight: 2500kg
ID Wafer Slicer MD-45s153b

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier
People who viewed this also viewed