ID Wafer Slicer MD-45s153b

• Specification: 1000mm*1100mm*1600mm
• Trademark: minder-hightech
• Origin: Guangzhou
• Model NO.: MD-45S153B
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Inner diameter slicer and optical edger

Product description:ID wafer Slicer MD-45S153B

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.
Main Features Spindle unit: It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.


MD-45S153B

Diameter of Cutting Ingot:	¢153mm
Blade Standard:	¢690mm×¢241mm×0.15mm or ¢690mm× ¢235mm×0.15mm
Length of Cutting Ingot:	400mm
Cutting speed:	0.2~99mm/min
Return Speed:	1~1000mm/min
The speed of main spindle:	1420r/min
Stepping deviation of feeding :	±0.005mm(testing with l mm feeding step)
Range of Wafer Thickness:	0.001~68.00mm
Adjustment only of Crystal Direction:	0.001mm
Adjustment of Crystal Direction:	Horizontal range(x)±7°(resolution:2') Vertical range(Y)±7º(resolution:2')
Power:	3.5kw,~380v±38v, 50HZ±1HZ
Source of Air:	0.4~0.5MPa,250L/min(instantaneous flux when braking)
Sour of cooling water:	0.2~0.4mpa;5L/min
Touching Panel:	7.7inch
Dimension:	645mm*925mm*2820mm
Weight:	2500kg