Manual Ultrasonic Gold Wire Ball Bonder

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Transport Package: Plywood Packing by Fast Express
Diamond Member Since 2017

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1000000 RMB
  • Manual Ultrasonic Gold Wire Ball Bonder
  • Manual Ultrasonic Gold Wire Ball Bonder
  • Manual Ultrasonic Gold Wire Ball Bonder
  • Manual Ultrasonic Gold Wire Ball Bonder
  • Manual Ultrasonic Gold Wire Ball Bonder
  • Manual Ultrasonic Gold Wire Ball Bonder
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Basic Info.

Model NO.
MDBB-1750
Specification
50kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
500/Year

Product Description

Manual Ultrasonic Gold Wire Ball BonderManual Ultrasonic Gold Wire Ball BonderManual Ultrasonic Gold Wire Ball BonderManual Ultrasonic Gold Wire Ball BonderManual Ultrasonic Gold Wire Ball BonderManual Ultrasonic Gold Wire Ball Bonder

Application:

LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 
2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm 
15,weight:28kg 

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
 
 

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