High Reliability Multi Wire Saw From China Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da600
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Product Highlights
- High-Speed Cutting: Wire speed reaches up to 2100m/min for efficient processing.
- Multi-Material Slicing: Ideal for Sapphire, Quartz, Ceramics, and Silicon Nitride.
- High Precision System: Three main rollers with synchronous drive ensure high reliability.
- Large Capacity: Handles 4-8 inch products with max work size 4'-8'x600mm.
- Fast Response Support: Respond within 12 hours and arrive on-site within 72 hours.
- Long-Term Spare Parts: Guaranteed spare parts supply for more than 10 years.
- Robust Design: Features abrasion, corrosion, and high-temperature resistance.
- CE Certified: Meets CE certification standards for safety and quality.
Product Attributes
- Customization
- Available
- After-sales Service
- 1 Year
- Function
- Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold
- Model NO.
- DA600
- Certification
- CE
- Warranty
- 12 Months
- Automatic Grade
- Semiautomatic
- Maximum Work Size
- 4"-8"×600mm
- out Diameter *Workable Width
- φ180mm-φ200mm*610mm* 3 Rollers
- Component
- Resin(PU)
- Storage
- 40km(φ0.25mm)
- Running Speedrunning Speed
- 2100m/Min
- Travel of Table
- 295mm
- Swing Angle
- ±10deg
- Flow Rate
- 12000L/H
- Rated Power
- 180kVA
- Size L*W*H
- 3700X1650X3200mm
- Weight
- 13000kg
- Transport Package
- 3700mm*1650mm*1650mm
- Specification
- 3700mm*1650mm*1650mm
- Trademark
- minder-hightech
- Origin
- Guangzhou
Product Images of High Reliability Multi Wire Saw From China Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da600
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Product Description
The equipment is mainly used for slicing super hard and brittle materials such as Sapphire, Silicon Carbide,Optical Glass, Quartz Crystal, Special Ceramics, Alumina and Silicon Nitride.
The machine has large loadingcapacity,high wire speed, fine linearity and three main rollers with three motors synchronous drive system, high precision, high reliability, high productivity, and can cut4~8 inch products.
1. The maximum workpiece length that can be carried is 600mm with high productivity.
2. Adopting exclusive spindle box system, the wire speed can reach up to 2100m/min.
3. Upside down rocking table cutting with high cutting power.
4. Adopt three main rollers and three motors synchronous drive system, high synchronization and long life of main rollers.
| Item | Detail | Parameter |
| Ability | Maximum work size | 4"-8"×600mm |
Wire Guide Roller |
Out diameter *Workable width | φ180mm-φ200mm*610mm* 3 rollers |
| Component | Resin(PU) | |
Diamond wire |
Wire diameter | φ0.10mm-φ0.25mm |
| Storage | 40km(φ0.25mm) |
|
| Running speed | 2100m/min | |
Workbench |
Travel of table |
295mm |
| Swing angle | ±10deg | |
Cutting fluid |
Flow rate | 12000L/h |
| Storage | 420L | |
Power supply |
Power | Three-phase 380V50Hz |
| Rated Power | 180KVA | |
| Air supply | ≥0.4MPa | |
| Size&Weight | Size L*W*H | 3700x1650x3200mm |
| Weight | 13000Kg |

There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours.
About the Supplier
This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASR2311045". Items marked "" are certified.
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Our chief technical expert comes from the School of Mechanical Engineering, South China University of Technology, and we are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.
We provide the equipment for semiconductor packaging factories and laboratories: Die bonder, Wire bonder, Glue encapsulate machine, Bond tester, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, etc.
We provide the equipment for semiconductor Fab factories and lab including: DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, and line of laboratory equipment.
We also provide the equipment for electronic and battery pack assembly plants: Soldering machine, Glue dispenser, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance welder etc.
We are engaged in the trade of microelectronic equipment and semiconductor equipment in Chinese Mainland, not only sell equipment, but also provide you with comprehensive professional solutions and after-sales services.
Until today, our brand's products have spread to major industrialized countries' factory and laboratories around the world, helping customers improve efficiency, reduce costs, and improve product quality.
About Our Factory & Business Background
- Address
- Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
-
Registered Capital
- 1,000,000 RMB
-
Terms of Payment
- T/T
-
International Commercial Terms(Incoterms)
- EXW
-
Average Lead Time
-
Peak Season Lead Time: one month
Off Season Lead Time: one month -
Nearest Port
- Shenzhen Port
Our Production Capability & Technical Expertise
- Main Products
- Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
-
R&D Engineers
- 1 people
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2014-12-30
- Export Year
- 2014-12-31
-
Main Markets
- North America, Europe
-
Overseas Agent/Branch
- No
FAQ
- What materials can this machine cut?
- It is designed for slicing super hard and brittle materials such as Sapphire, Silicon Carbide, Optical Glass, Quartz Crystal, Special Ceramics, Alumina, and Silicon Nitride.
- What is the maximum wire speed?
- The machine adopts an exclusive spindle box system allowing wire speed to reach up to 2100m/min.
- What is the warranty period?
- We provide a 1-year warranty. After the warranty period, we continue to provide equipment maintenance service once a year for no less than two years.
- How long does it take to respond to service requests?
- We respond within 12 hours and arrive at the scene within 72 hours.
- What is the rated power consumption?
- The rated power is 180KVA, requiring a three-phase 380V 50Hz power supply.
- Can the machine handle 4-8 inch products?
- Yes, the machine can cut 4-8 inch products with a maximum work size of 4'-8' x 600mm.
- What is the lead time for orders?
- The average lead time is one month for both peak season and off-season.
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