| After-sales Service: | 1 Year Warranty |
|---|---|
| Precision: | High Precision |
| Condition: | New |
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Product Description
MD5060 is fully automatic slice machine which is used in slicing semiconductor, crystal,gemstone, ceramics, graphite, samarium cobalt, ND-Fe-B magnetic materials and other hard brittle materials. The round inner-blade diamond blade mounted on the spindle cutter is operated at high speed, and the table is controlled by the computer to move horizontally and vertically, and the material on the fixture is cut into the required product. A worker can operate about 30 units at the same time.
Application
Magnetic materials (NdFeB, SmCo, ferrite, niobium, etc.), optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, gemstone and other hard brittle materials
Technical parameters
| Maximum processing size (mm) | Φ60 * 80 mm | |
| Cutting speed (cm2/mm) | 3-6 ((cm2/mm)) | |
| Sliced sheet balance deviation (mm) | ±0.005mm | |
| Cutting slice thickness (mm) | ≥0.30 | |
| Tolerance range (mm) of slices | ±0.01mm | |
| Lateral stroke (mm) | 120mm | |
| Longitudinal stroke (mm) | 100mm, longitudinal indexing range 0-100 grid, 0.01 per grid, 2mm per revolution | |
| Spindle electromechanical | 3-phase 0.75kw | |
| Spindle speed (r/min) | 3000rpm | |
| Work fixture adjustment | Horizontal angle | ±45º |
| Pitch angle | ±10º | |
| Vertical lift (mm) | 24 | |
| Cooling box volume (kg) | 50kg | |
| Cooling box motor | 3-phase 0.12kw 2780r/min | |
| Power supply | 3-phase four-wire 50Hz 380V | |
| Dimension | 1050*730*1400mm | |
| Weight |
800kg | |
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