• ID Slice Machine / Inner Circle Slicer for Semiconductor Crystal Gemstone
  • ID Slice Machine / Inner Circle Slicer for Semiconductor Crystal Gemstone
  • ID Slice Machine / Inner Circle Slicer for Semiconductor Crystal Gemstone
  • ID Slice Machine / Inner Circle Slicer for Semiconductor Crystal Gemstone

ID Slice Machine / Inner Circle Slicer for Semiconductor Crystal Gemstone

After-sales Service: 1 Year Warranty
Type: Horizontal Lathe
Processing Accessory: Centre CNC Lathe
Guide Rail: Horizontal Guide Rail
Tool Holder: Single-tool Holder CNC Lathe
Power Source: Electric
Samples:
US$ 0/Piece 1 Piece(Min.Order)
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Basic Info.

Model NO.
J5060
Controlling Mode
Artificial
Automatic Grade
Automatic
Setting Mode
Floor-type
Precision
High Precision
Condition
New
Maximum Processing Size (mm)
D60 * 80 mm
Cutting Speed (Cm2/mm)
3-6 (Cm2/mm)
Sliced Sheet Balance Deviation (mm)
±0.005mm
Cutting Slice Thickness (mm)
≥0.30
Tolerance Range (mm) of Slices
±0.01mm
Lateral Stroke (mm)
120mm
Longitudinal Stroke (mm)
100mm
Spindle Electromechanical
3-Phase 0.75kw
Spindle Speed (R/Min)
3000rpm
Cooling Box Volume (Kg)
50kg
Cooling Box Motor
3-Phase 0.12kw
Power Supply
3-Phase Four-Wire 50Hz 380V
Transport Package
Standard Export Wooden Case Packing
Specification
1050*730*1400mm
Trademark
Minder
Origin
China
Production Capacity
80 Pieces/ Month

Product Description

Product Description
J5060 is fully automatic slice machine which is used in slicing semiconductor, crystal,gemstone, ceramics, graphite, samarium cobalt, ND-Fe-B magnetic materials and other hard brittle materials. The round inner-blade diamond blade mounted on the spindle cutter is operated at high speed, and the table is controlled by the computer to move horizontally and vertically, and the material on the fixture is cut into the required product. A worker can operate about 30 units at the same time.
Application
Magnetic materials (NdFeB, SmCo, ferrite, niobium, etc.), optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, gemstone and other hard brittle materials
Technical parameters

Maximum processing size (mm) Φ60 * 80 mm
Cutting speed (cm2/mm) 3-6 ((cm2/mm))
Sliced sheet balance deviation (mm) ±0.005mm
Cutting slice thickness (mm) ≥0.30
Tolerance range (mm) of slices ±0.01mm
Lateral stroke (mm) 120mm
Longitudinal stroke (mm) 100mm, longitudinal indexing range 0-100 grid, 0.01 per grid, 2mm per revolution
Spindle electromechanical 3-phase 0.75kw
Spindle speed (r/min) 3000rpm
Work fixture adjustment Horizontal angle ±45º
Pitch angle ±10º
Vertical lift (mm) 24
Cooling box volume (kg) 50kg
Cooling box motor 3-phase 0.12kw 2780r/min
Power supply 3-phase four-wire 50Hz 380V
Dimension 1050*730*1400mm
Weight
 
800kg
We have many types of machines, such as ID slice machine(Inner circle slicer, inside diameter slicer, ID saw), Automatic square grinding machine, semi-auto square grinding machine

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