Type: | Substrate Grinding Machine |
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Abrasives: | Grinding Wheel |
Controlling Mode: | CNC |
Automatic Grade: | Automatic |
Certification: | CE |
Condition: | New |
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Process Type |
Sort by Process Material |
Sort by Application |
|
Substrate thinning |
Metals and Alloys
Industrial Ceramics Oxidizing substances Carbide
Glass
plastic
|
Semi Conductor |
Wafer substrate Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc. |
Resin | PE,E/VAC,SBS,SBR,NBR,SR,BR,PR | ||
PCB | Adhesive, coating, circuit | ||
Optical | Optical lenses, optical reflectors, scintillation crystals, holographic projection glass, HUD glass, screen glass, | ||
Radar | oxide skin |
Regular Specification | |
Machine Series | MDFD250HG |
Work Table Diameter | Φ250 mm / 10 inches |
Maximum Grinding Diameter | Φ250 mm |
Minimum Grinding Thickness | T≥35μm (12" with carrier) |
Grinding Roughness | Ra≤0.02μm (with abrasive of grains grits 2000) |
Feeding Resolution | RES = 0.1 μm |
Grinding Feeding Speed | 0.1 ~ 10μm/sec (grinding feeding speed) |
Fast Feeding Speed | 0.01 ~ 1mm/sec (from origin point to pre-feeding position) |
No. of Worktable | 1 |
Wheel Rotate Speed | 0-3000 rpm |
Worktable Rotate Speed | 0-300 rpm |
Upper Spindle Power | Electric Spindle 5.5kW |
Lower Spindle Power | Electric Spindle 2.2kW |
Coolant Tank Volume | 75L |
Pulse Hand Wheel Resolution | 1×, 10×, 100× |
Pneumatic Source | 0.6-0.8MPa |
Total Weight | 1200 kg |
Dimension | 1150×1200×2000 mm |
Optional Choice | Specification |
Non-Contact (Infrared) Thickness Gauge |
Brand: Marposs Resolution:0.1μm Measurement Precision: ≤0.5μm |
Contact Thickness Gauge |
Brand: Marposs Resolution:0.1μm Measurement Precision: ≤0.5μm |
(Upper Spindle) Aerostatic Graphite Electric Spindle |
Power: 5.5kW Spindle Balance:0.05μm(3000rpm) |
Grinding Wheel |
Grains Grits Size: 320 to 6000 Abrasive Material: |
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