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Guangzhou Minder-Hightech Co., Ltd.

Heavy Wire Bonder, Heavy Wire Bonding Machine, Wedge Bonder manufacturer / supplier in China, offering Manual Ultrasonic Heavy Wire Wedge Bonder Mdb-7550, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product Wire bonders Manual wire bonder Manual Ultrasonic Heavy Wire Wedge Bonder Mdb-7550

Manual Ultrasonic Heavy Wire Wedge Bonder Mdb-7550

FOB Price: US $1-8,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-8,000/ Piece
Get Latest Price
Port: Guangzhou, China
Production Capacity: 500/Year
Payment Terms: T/T
Basic Info
  • Model NO.: MDB-7550
  • Transport Package: Plywood Packing by Fast Express
  • Origin: Guangzhou
  • Trademark: minder-hightech
  • Specification: 70kg
  • HS Code: 8515809090
Product Description
Manual Ultrasonic Heavy Wire Wedge Bonder Mdb-7550


High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment,auto sensors, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.


1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)
3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel
5,bond force:30-1200g,two channel
6,motorized Y:0-18mm
7,microscope rate:7.5 and 15
8,working area:Φ25mm
9,light:adjustable brightness

guangzhou minder-hightech co.,ltd  

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