Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575

• Transport Package: Plywood Packing by Fast Express
• Specification: 50kg
• Trademark: minder-hightech
• Origin: Guangzhou
• Model NO.: mdb-2575
• HS Code: 8515809090
• Production Capacity: 500/Year

Product Description

Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm wedge bonding.

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone0086-15813334038