After-sales Service: | 1 Year |
---|---|
Warranty: | 1 Year |
Weight: | 280kg |
Specification: | 750(D)*1050(W)*1450(H)mm |
Trademark: | minder-hightech |
Origin: | Guangzhou |
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Bonding Head and Table | |
XY travel | 4"*4"(LED); 3"*3"(COB) |
0 | ±360° |
Z travel | 0.4" |
Resolution | 0.02mil |
Bond angle | 30° |
Wire size | 0.7mil~2.0mil |
Bond force | 15~200gm(adjustable) |
Bond power | 0~2Watt(adjustable) |
Bond head clearance | 4.8mm |
F/T resolution | Adjustable |
Bonding through put | UPH 10k(LED) 8wire/sec(COB, based on 2mm wire length) |
Transducer and Power Unit | |
Transducer | Aluminum alloy light weight type |
Power generator | Auto-cal ultrasonic generator |
Alignment Reference | |
Die | 0, 1 or 2 points |
Substrate | 0, 1 or 2 points |
Image Recognition System | |
XY | ±1mm(3.5 times amplification) |
0 | ±15° |
Accuracy | ±1/4 pixel |
Recognition time | 120ms |
Optic | |
Microscope | 10~30 times, dual FOV zoom |
Power Supply | |
Voltage | AC110V/220V |
Frequency | 50/60HZ |
Power consumption | 800W(Max) |
Program Storage Capacity | |
Number of program | Practically unlimited |
Number of chips | 1000chips/program |
Number of wire | 1000wire/chip |
Dimensions and Weight | |
Weight | 280kg |
Size | 750(D)*1050(W)*1450(H)mm |
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