Wafer Back Grinder Mdfd-300vst

• Specification: 1125*2000*1750mm
• Trademark: minder-hightech
• Origin: Guangzhou
• Model NO.: MDFD-300VST
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description
Application:

mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .
it is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.
this machine is very easy for operator.



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