LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Wire Bonder/Ultrasonic Manual Wire Bonding Machine

• Transport Package: Plywood Packing by Fast Express
• Specification: 50kg
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 500/Year

Product Description

Application:

LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 
2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm 
15,weight:28kg 

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu