• High Efficiency Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da300

High Efficiency Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da300

After-sales Service: 1 Year
Function: Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold
Condition: New
Certification: CCC, PSE, FDA, RoHS, ISO, CE
Warranty: 12 Months
Automatic Grade: Semiautomatic
Diamond Member Since 2017

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  • Overview
  • Product Description
  • Product features
  • Product Parameters
  • Sample
  • Product maintenance
Overview

Basic Info.

Model NO.
DA300
Mould Life
<300,000 Shots
Maximum Work Size Od*L
4"-8"×300mm
Thickness of Slice
0.5mm~10mm
out Diameter *Workable Width
φ190mm-φ210mm*300mm
Quantity
3 Rollers
Component
Resin(PE or PU)
Wire Diameter
φ0.12mm-φ0.25mm
Storage
40km
Wire Speed
2400m/Min
Travel of Tabletravel of Table
Max240mm
Number of Workbench
1
Feed Rate
0.1-99.9mm/Min
Swing Angle
±10deg
Flow Rate
12000L/H
Weight
12000kg
Transport Package
Guangzhou
Specification
4000x1600x3200mm
Trademark
minder-hightech
Origin
Guangzhou

Product Description

Product Description

 

High Efficiency Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da300DA300 series multi-wire saws are mainly used to precisely cut 4~8 inch Sapphire, Silicon Carbide and other Semiconductorsuper hard and brittle materials, providing the industry with solutions for high wirespeed and large size requirements.
Product features

1-High-precision multi-wire cutting equipment developed forsilicon carbide crystals.Providing solutions for high precision, high
wire speed, and large size.
2- Suitable for precise cutting of 4~8inch products, which can be flexibly customized according to customer requirements.
3- Maximum wire speed up to 2400m/min with high cutting efficiency.
4-Flexible switching between slurry steel wire cutting and diamond wire cuttingFlexible switching between slurry steel wire cutting and diamond wire cutting.

Product Parameters

 

Item         Detail Parameter
Ability Maximum work size OD*L 4"-8"×300mm
Thickness of slice 0.5mm~10mm

Wire Guide Roller
Out diameter *Workable width φ190mm-φ210mm*300mm
Quantity 3 Rollers
Component Resin(PE or PU)

Diamond wire
Wire diameter φ0.12mm-φ0.25mm
Storage 40km
Wire speed 2400m/min
Running direction Unidirectional/Bidirectional


Workbench
Travel of table
 
Max240mm
Feed rate 0.1-99.9mm/min
Number of workbench 1
Cutting method Worktable moves from up to down"
Swing angle ±10deg

Tension
Tension adjustment 5-50N
Tension system accuracy during cutting ±0.5N

Cutting fluid
Fluid Cutting Fluid
Storage 420L
Flow rate 12000L/h

Power supply
Powersupply Three-phase 380V50Hz
Power 120kw
Airsupply ≥0.4MPa
Size&Weight Size L*W*H 4000x1600x3200mm
Weight 12000Kg
Sample

High Efficiency Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da300High Efficiency Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da300

Product maintenance

Technical Services
There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours.

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