• Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
  • Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
  • Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
  • Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
  • Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
  • Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575

Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575

Transport Package: Plywood Packing by Fast Express
Specification: 50kg
Trademark: minder-hightech
Origin: Guangzhou
Diamond Member Since 2017

Suppliers with verified business licenses

Basic Info.

Model NO.
MDB-2575
HS Code
8515809090
Production Capacity
500/Year

Product Description

Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg
 

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