Gold Member Since 2017
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Guangzhou Minder-Hightech Co., Ltd.

Ball Bonder, Automatic Ball Bonder, Automatic Wire Bonder manufacturer / supplier in China, offering Automatic Gold Wire Ball Bonder, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product Wire bonders Automatic wire bonder Automatic Gold Wire Ball Bonder

Automatic Gold Wire Ball Bonder

FOB Price: US $1-45,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-45,000/ Piece
Get Latest Price
Port: Guangzhou, China
Production Capacity: 200PCS/Year
Payment Terms: T/T
Basic Info
  • Model NO.: md-k750
  • Transport Package: Plywood Packing by Sea
  • Origin: Guangzhou
  • Trademark: minder-hightech
  • Specification: 900kg
  • HS Code: 8015809090
Product Description
Automatic Gold Wire Ball Bonder
Automatic Gold Wire Ball Bonder
Automatic Gold Wire Ball Bonder
Automatic Gold Wire Ball Bonder


Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)

Bonding principle: ultrasonic.

System:windows XP based.

Min wire diameter:0.5mil.


Wire material:gold/copper/alloy/silver.


Bonding speed:50ms/wire

Bonding accuracy:+-3.0um

Wire length:Max:8mm

Wire diameter:15-50um

Bonding area:56-65mm

Bonding type:single wire/BSOB/BBOS

XY resolution:0.1um

Transducer system:138khz

PR accuracy:+-0.37um(4x),+-0.74(2x)

Applicable magazine:

L:120-305mm  W:45-98mm H:50-180mm

Magazine pitch:Min:1.4mm

Applicable lead frame:

L:100-300mm W:40-90mm T:0.1-1.3mm

Voltage:190-240V 50Hz

Compressed air:0.6-0.97bar

Air consumption:80L/min




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