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Guangzhou Minder-Hightech Co., Ltd.

Wafer Grinder, Wafer Grinding Machine, Back Grinder manufacturer / supplier in China, offering Simplified Wafer Muller for 12" Wafer, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product ungrouped Simplified Wafer Muller for 12" Wafer

Simplified Wafer Muller for 12" Wafer

FOB Price: US $1-57,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-57,000/ Piece
Get Latest Price
Port: Guangzhou, China
Production Capacity: 100/Year
Payment Terms: T/T
Basic Info
  • Model NO.: mdfd-320
  • Power Source: Electricity
  • Application: Semiconductor
  • Material: Panel
  • Disc Diameter: 230mm
  • Trademark: minder-hightech
  • Specification: 1000kg
  • HS Code: 8486209000
  • Type: Disc Grinder
  • Object: Turning Tool
  • Disc(Wheel) Type: Grinding Disc
  • Working Style: High-speed universal
  • Variable Speed: With Variable Speed
  • Transport Package: Plywood
  • Origin: Guangzhou
Product Description
simplified wafer muller for 12" waferSimplified Wafer Muller for 12

Application:

      This ginder is suitable for high hardness,thin,and high precision product. like LED sapphire substrate,quartz crystal,silicon wafer,ceramic,wolfram plate, germanium plate thinning(grinding)

 

Principle:

     This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.

This machine can auto aiming the tool, actually test the grinding torque,automatic adjust the grinding speed, so to avoid broking the wafer.

 

1,Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.

2,High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.

 

Specification:

Model

MDYM-150WH

MDYM-180WH

MDYM-200WH

MDYM-230WH

MDYM-300WH

Grinding wheel

D150*h25mm

D180*h25mm

D200*h30mm

D230*h30mm

D300*h30mm

Max material size

D150mm

D180mm

D200mm

D230mm

D300mm

Material spindle speed(adjustable)

0-1000rpm

0-1000rpm

 0-800rpm

 0-800rpm

 0-800rpm

Grinding wheel speed(adjustable)

0-2000rpm

0-2000rpm

0-1800 rpm 

0-1800 rpm 

0-1800 rpm 

Grinding wheel motor power

1.5kw/3*380V

1.5kw/3*380V

2.2kw/3*380V

2.2kw/3*380V

2.2kw/3*380V

Material spindle motor power

0.75kw/3*380V

0.75kw/3*380V

0.75kw/3*380V

0.75kw/3*380V

1.1kw/3*380V

Parallelism

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

Dimension(mm)

1200*550*1550

1200*550*1550

1350*600*1600

1350*600*1600

1500*700*1650

Weight

760kg

850kg

960kg

1000kg

1100kg


some grinding sample:
Simplified Wafer Muller for 12

factory view:
Simplified Wafer Muller for 12
Simplified Wafer Muller for 12

Other type of grinder and polisher:

Simplified Wafer Muller for 12

-----------------------------------------------------------------------------------------------------------------------------------------------------------Simplified Wafer Muller for 12

guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone:0086-15813334038
 



 
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