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Guangzhou Minder-Hightech Co., Ltd.

Ball Bonding Machine, Automatic Ball Bonding Machine, Automatic Wire Bonding Machine manufacturer / supplier in China, offering Automatic Ultrasonic Gold Wire Ball Bonding Machine, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product Wire bonders Automatic wire bonder Automatic Ultrasonic Gold Wire Ball Bonding Machine

Automatic Ultrasonic Gold Wire Ball Bonding Machine

FOB Price: US $1-45,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-45,000/ Piece
Get Latest Price
Production Capacity: 200PCS/Year
Transport Package: Plywood Packing by Sea
Payment Terms: T/T
Basic Info
  • Model NO.: md-k750
  • Specification: 900kg
  • HS Code: 8015809090
  • Trademark: minder-hightech
  • Origin: Guangzhou
Product Description
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine
 

Character:

Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)

Bonding principle: ultrasonic.

System:windows XP based.

Min wire diameter:0.5mil.

Language:Chinese/english

Wire material:gold/copper/alloy/silver.

Specification:

Bonding speed:50ms/wire

Bonding accuracy:+-3.0um

Wire length:Max:8mm

Wire diameter:15-50um

Bonding area:56-65mm

Bonding type:single wire/BSOB/BBOS

XY resolution:0.1um

Transducer system:138khz

PR accuracy:+-0.37um(4x),+-0.74(2x)

Applicable magazine:

L:120-305mm  W:45-98mm H:50-180mm

Magazine pitch:Min:1.4mm

Applicable lead frame:

L:100-300mm W:40-90mm T:0.1-1.3mm

Voltage:190-240V 50Hz

Compressed air:0.6-0.97bar

Air consumption:80L/min

Dimension:1230*940*1660mm

Weight:800kg

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone0086-15813334038
 

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