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Guangzhou Minder-Hightech Co., Ltd.

Wire Bonding Machine, Ball Bonding Machine, Gold Wire Bonding Machine manufacturer / supplier in China, offering Manual Ultrasonic Gold Wire Ball Bonding Machine Mdbb1750, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product Wire bonders Manual wire bonder Manual Ultrasonic Gold Wire Ball Bonding Machine Mdbb1750

Manual Ultrasonic Gold Wire Ball Bonding Machine Mdbb1750

FOB Price: US $1-5,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-5,000/ Piece
Get Latest Price
Port: Guangzhou, China
Production Capacity: 500/Year
Payment Terms: T/T
Basic Info
  • Model NO.: MDBB1750
  • Transport Package: Plywood Packing by Fast Express
  • Origin: Guangzhou
  • Trademark: minder-hightech
  • Specification: 50kg
  • HS Code: 8015809090
Product Description
Manual Ultrasonic Gold Wire Ball Bonding Machine Mdbb1750

Application:

LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 
2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm 
15,weight:28kg 

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone//:0086-15813334038
 

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