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Guangzhou Minder-Hightech Co., Ltd.

Wire Bonder, Wedge Bonder, Thin Wire Bonder manufacturer / supplier in China, offering Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575, IC LED Die Adhesive Thickness Measuring Microscope, IC LED Die Height Measuring Microscope and so on.

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Supplier Homepage Product Wire bonders Manual wire bonder Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575

Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575

FOB Price: US $1-5,000 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1-5,000/ Piece
Get Latest Price
Port: Guangzhou, China
Production Capacity: 500/Year
Payment Terms: T/T
Basic Info
  • Model NO.: MDB-2575
  • Transport Package: Plywood Packing by Fast Express
  • Origin: Guangzhou
  • Trademark: minder-hightech
  • Specification: 50kg
  • HS Code: 8515809090
Product Description

Manual Ultrasonic Thin Wire Wedge Bonder Mdb2575
Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg
 


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